Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, manufacturing method of electronic device, and electronic device

Patent metadata

Field	Value
Publication number	US-9291896-B2
Application number	US-201514605264-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Jul 27, 2012
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin containing a repeating unit represented by the specific formula (1) and a repeating unit represented by the specific formula (A); a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manufacturing method of an electronic device.

First claim

The invention claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a compound capable of generating an acid upon irradiation with an actinic ray or radiation,
a resin (P) containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (A), and
a solvent:

wherein each of R′ and L 1 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group, L 1 may combine with L to form a ring and in this case, L 1 represents a single bond, an alkylene group or a carbonyl group,
L represents a single bond or a divalent linking group, and in the case of forming a ring together with L 1 , L represents a trivalent linking group,
each of R 1a , R 1b and R 1c independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or a heterocyclic group,
at least two of R 1a , R 1b and R 1c may combine with each other to form a ring, or at least one of R 1a , R 1b and R 1c may combine with R 2 to form a ring,
R 2 represents an alkyl group or a cycloalkyl group, and
R 3 represents a hydrogen atom or an alkyl group;

wherein each of R 21 , R 22 and R 23 independently represents a hydrogen atom, an alkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group, provided that R 22 may combine with Ar 2 to form a ring and in this case, R 22 represents a single bond or an alkylene group,
X 2 represents a single bond, —COO— or —CONR 30 —, wherein R 30 represents a hydrogen atom or an alkyl group,
L 2 represents a single bond or an alkylene group,
Ar 2 represents an (n+1)-valent aromatic ring group and in the case of combining with R 22 to form a ring, Ar 2 represents an (n+2)-valent aromatic ring group, and
n represents an integer of 1 to 4.

2. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein in formula (1), each of R 1a , R 1b and R 1c is independently an alkyl group or a cycloalkyl group.

3. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein in formula (1), R 3 is a hydrogen atom.

4. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein in formula (1), L is a single bond, a divalent aromatic group, a divalent group having a norbornylene group, or a divalent group having an adamantylene group.

5. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the repeating unit represented by formula (1) is a repeating unit represented by any one of the following formulae (1-1) to (1-4):

wherein in formulae (1-1) to (1-4),
R′, R 1a , R 1b , R 1c , R 2 and R 3 have the same meanings as R′, R 1a , R 1b , R 1c , R 2 and R 3 in formula (1), respectively, and
at least two of R 1a , R 1b and R 1c may combine with each other to form a ring, or at least one of R 1a , R 1b and R 1c may combine with R 2 to form a ring.

6. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the repeating unit represented by formula (A) is a repeating unit represented by the following formula (A1) or (A2):

wherein R 23 has the same meaning as R 23 in formula (A).

7. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) further contains a repeating unit having a lactone group.

8. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) further contains a repeating unit having a plurality of aromatic rings represented by the following formula (c1):

in formula (c1), R 3 represents a hydrogen atom, an alkyl group, a halogen atom, a cyano group or a nitro group;
Y represents a single bond or a divalent linking group;
Z represents a single bond or a divalent linking group;
Ar represents an aromatic ring group; and
p represents an integer of 1 or more.

9. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) contains a repeating unit having a group capable of decomposing by the action of an acid in addition to the repeating unit represented by formula (1).

10. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) further contains a repeating unit represented by the following formula (4):

R 41 represents a hydrogen atom or a methyl group;
L 41 represents a single bond or a divalent linking group;
L 42 represents a divalent linking group; and
S represents a structural moiety capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid on the side chain.

11. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 , wherein the total number of the carbon number of R 1a to R 1c is 4 or more.

12. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 , wherein at least two of R 1a , R 1b and R 1c combine with each other to form a ring.

13. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 , wherein R 1a , R 1b and R 1c form a polycyclic alicyclic group.

14. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 , wherein the actinic ray-sensitive or radiation-sensitive resin composition further contains a hydrophobic resin.

15. A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 .

16. A pattern forming method comprising:
(i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 ,
(ii) a step of exposing the film, and
(iii) a step of developing the exposed film by using a developer to form a pattern.

17. The pattern forming method as claimed in claim 16 , wherein the exposure is performed using an X-ray, an electron beam or EUV.

18. A pattern forming method comprising:
(i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 ,
(ii) a step of exposing the film, and
(iii') a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.

19. The pattern forming method as claimed in claim 18 , wherein the exposure is performed using an X-ray, an electron beam or EUV.

20. A method for manufacturing an electronic device, comprising:
(i) providing an inorganic or coating-type inorganic substrate suitable for use in producing a

Assignees

• Fujifilm Corp

Inventors

• Hirano Shuji
• Yokokawa Natsumi
• Takizawa Hiroo
• Nihashi Wataru

Classifications

• C08F212/24 Primary

  Phenols or alcohols · CPC title

• H10P76/2041

  Photolithographic processes · CPC title

• C08F22/10

  Esters · CPC title

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/2002

  with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title