Methods of creating exposed cavities in molded electronic devices

Patent metadata

Field	Value
Publication number	US-11723151-B2
Application number	US-202217719348-A
Country	US
Kind code	B2
Filing date	Apr 12, 2022
Priority date	Sep 26, 2019
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

First claim

The invention claimed is:

1. A method comprising:
assembling at least one electronic device with a sensor or an emitter;
placing a cover over the sensor or the emitter;
placing the electronic device into a mold cavity of a transfer mold, wherein the mold cavity has a height substantially identical to a height of the cover;
encapsulating the electronic device with an encapsulant, yielding an encapsulated electronic device;
removing the encapsulated electronic device from the transfer mold;
placing the encapsulated electronic device in a milling machine;
determining a position of the sensor or the emitter; and
milling a top portion of the cover to expose the sensor or the emitter based on the position of the sensor or the emitter.

2. The method of claim 1 , wherein the electronic device includes a printed circuit board.

3. The method of claim 2 , wherein placing the cover includes soldering the cover to the printed circuit board.

4. The method of claim 2 , wherein placing the cover includes adhering the cover to the printed circuit board.

5. The method of claim 2 , wherein the cover does not extend to a printed circuit board.

6. The method of claim 1 , wherein the encapsulant is a charge material.

7. The method of claim 1 , wherein milling includes milling material across an entirety of a surface of the encapsulated electronic device.

8. The method of claim 1 , further comprising vacuuming milling debris from a surface of the emitter or the sensor.

9. The method of claim 1 , further comprising registering the position of the sensor or the emitter with a coordinate system of the milling machine.

10. The method of claim 1 , further comprising singulating the encapsulated electronic device from encapsulated electronic devices.

11. A method comprising:
assembling at least one electronic device with a sensor or an emitter;
attaching a cover over the sensor or the emitter;
placing the electronic device into a mold cavity of a transfer mold, wherein the mold cavity has a height substantially identical to a height of the cover;
encapsulating the electronic device with an encapsulant, yielding an encapsulated electronic device;
removing the encapsulated electronic device from the transfer mold;
placing the encapsulated electronic device in a grinder; and
grinding a top portion of the cover to expose the sensor or the emitter.

12. The method of claim 11 , further comprising grinding flash material from the encapsulated electronic device.

13. The method of claim 11 , wherein grinding includes grinding material across an entirety of a surface of the encapsulated electronic device.

14. The method of claim 11 , further comprising inverting the electronic device prior to grinding, such that grinding debris falls away from a surface of the sensor or the emitter.

15. The method of claim 11 , wherein the cover is formed of a tube or a hollow shape.

16. The method of claim 15 , wherein the tube or the hollow shape has no top or bottom.

17. A method comprising:
placing a cover over a sensor or an emitter of an electronic device;
placing the electronic device, including the cover, into a transfer mold system;
encapsulating the electronic device with an encapsulant, yielding an encapsulated electronic device; and
removing material across an entire surface of the encapsulated electronic device until a top portion of the cover is removed to expose the sensor or the emitter.

18. The method of claim 17 , further comprising grinding the entire surface of the encapsulated electronic device to remove the top portion of the cover.

19. The method of claim 17 , further comprising milling the encapsulated electronic device at known locations of the sensor or the emitter to expose the sensor or the emitter.

20. The method of claim 1 , wherein placing the cover includes fitting the cover over the sensor or the emitter such that the cover is held in place by the cover's fit over the sensor or the emitter.

Assignees

• Flex Ltd

Inventors

• Shangguan Dongkai
• Geiger David
• Iyer Venkat
• Yang Cheng

Classifications

• H10W74/016

  using moulds · CPC title

• H10P72/0612

  Production flow monitoring, e.g. for increasing throughput · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/0438 Primary

  Apparatus for making assemblies not otherwise provided for, e.g. package constructions · CPC title

• H05K3/0044 Primary

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title