Bonding apparatus, bonding system, bonding method and recording medium

Patent metadata

Field	Value
Publication number	US-11715663-B2
Application number	US-202117181021-A
Country	US
Kind code	B2
Filing date	Feb 22, 2021
Priority date	Mar 2, 2020
Publication date	Aug 1, 2023
Grant date	Aug 1, 2023

Abstract

A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.

First claim

We claim:

1. A bonding apparatus, comprising:
a first holder configured to attract and hold a first substrate from above;
a first transforming device configured to transform the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards;
a second holder provided under the first holder, and configured to attract and hold a second substrate, which is to be bonded to the first substrate, from below;
a second transforming device configured to transform the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards;
a suction device configured to generate different attracting forces in multiple division regions included in an attraction region of the second substrate;
a control device configured to control the suction device;
a base member on which the second holder is provided; and
a transformation space, which is formed between the second holder and the base member as a single and unitary space, configured to be pressurized to allow the second holder to be protruded upwards,
wherein the control device sets the attracting forces in the multiple division regions based on a state of the second substrate before being bonded such that a distortion of the second substrate is suppressed, and
the state of the second substrate includes at least one of a temperature of the second substrate, a thickness of the second substrate, and a bending amount of the second substrate.

2. The bonding apparatus of claim 1 ,
wherein the second holder is equipped with a wall member which divides the attraction region into the multiple division regions.

3. The bonding apparatus of claim 2 ,
wherein the wall member divides the attraction region into the multiple division regions along a diametrical direction of the second substrate.

4. The bonding apparatus of claim 2 ,
wherein the wall member divides the attraction region into the multiple division regions along a circumferential direction of the second substrate.

5. The bonding apparatus of claim 1 ,
wherein multiple suction holes are formed in the second holder, and wherein each multiple suction hole corresponds with a division region of the multiple division regions, and
the suction device attracts the second substrate via the multiple suction holes.

6. The bonding apparatus of claim 1 ,
wherein the control device changes the attracting forces in the multiple division regions during a bonding processing of the first substrate and the second substrate.

7. A bonding apparatus, comprising:
a first holder configured to attract and hold a first substrate from above;
a first transforming device configured to transform the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards;
a second holder provided under the first holder, and configured to attract and hold a second substrate, which is to be bonded to the first substrate, from below;
a second transforming device configured to transform the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards;
a suction device configured to generate different attracting forces in multiple division regions included in an attraction region of the second substrate;
a control device configured to control the suction device;
a base member on which the second holder is provided, a transformation space configured to be pressurized to allow the second holder to be protruded upwards being formed between the second holder and the base member; and
seal members provided to the base member and configured to seal the transformation space and a plurality of suction holes formed in the second holder, the seal members being allowed to be expanded/contracted,
wherein the seal members are in contact with a bottom surface of the second holder.

8. A bonding system, comprising:
a processing station comprising a bonding apparatus as claimed in claim 1 ; and
a carry-in/out station configured to transfer the first substrate and the second substrate into the processing station, and receive, from the processing station, a combined substrate in which the first substrate and the second substrate are bonded to each other.

9. A bonding method, comprising:
attracting and holding a first substrate from above by a first holder;
transforming the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards;
attracting and holding a second substrate from below by a second holder provided under the first holder;
transforming the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards; and
bonding the first substrate and the second substrate by bringing the first substrate whose central portion is protruded downwards and the second substrate whose central portion is protruded upwards into contact with each other,
wherein in the attracting and holding of the second substrate, the second substrate is attracted and held by different attracting forces generated in multiple division regions included in an attraction region of the second substrate,
wherein the second holder is provided on a base member,
a transformation space is formed between the second holder and the base member as a single and unitary space, and
in the transforming of the second substrate, the transformation space is pressurized to allow the second holder to be protruded upwards.

10. A non-transitory computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a bonding apparatus to perform a bonding method as claimed in claim 9 .

Assignees

• Tokyo Electron Ltd

Inventors

• Sugakawa Kenji
• Omori yosuke

Classifications

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/33

  into and out of processing chamber · CPC title