Use of steam for pre-heating of CMP components

Patent metadata

Field	Value
Publication number	US-11633833-B2
Application number	US-202016886238-A
Country	US
Kind code	B2
Filing date	May 28, 2020
Priority date	May 29, 2019
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

First claim

What is claimed is:

1. A method of temperature control for a chemical mechanical polishing system, comprising:
while a component of the polishing system is spaced away from a polishing pad of the polishing system, directing a gas that includes steam from an orifice onto the component to raise a temperature of the component to an elevated temperature; and
before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

2. The method of claim 1 , comprising measuring a temperature of the component while the steam is directed onto the component and halting the steam when the component reaches a target temperature.

3. The method of claim 2 , comprising measuring a temperature of the polishing pad, and calculating the target temperature based on the measured temperature.

4. The method of claim 1 , comprising setting a timer and halting the steam at expiration of the timer.

5. The method of claim 1 , wherein the temperature of the component is approximately equal to a temperature of the polishing pad when the component is placed into contact with the polishing pad.

6. The method of claim 5 , wherein the elevated temperature is greater than the temperature of the polishing pad.

7. The method of claim 1 , wherein the gas has a temperature of 70-100° C.

8. The method of claim 1 , wherein the steam comprises dry steam.

9. The method of claim 1 , wherein the gas consists of steam.

10. The method of claim 1 , comprising positioning the component in a treatment station spaced from the polishing pad and directing steam onto the component at the treatment station.

11. The method of claim 10 , comprising rotating the component in the treatment station as steam is directed onto the component.

12. The method of claim 10 , comprising vertically moving the component in the treatment station as steam is directed onto the component.

13. The method of claim 1 , wherein the component comprises a carrier head or a substrate to be polished.

14. The method of claim 13 , wherein the steam is directed onto the component at a substrate transfer station.

15. A method of temperature control for a chemical mechanical polishing system, comprising:
while a component in the polishing system is spaced away from a polishing pad of the polishing system, directing a gas that includes steam from an orifice onto the component to raise a temperature of the component to an elevated temperature, wherein the steam is directed onto the component at an inter-platen station; and
before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

16. A method of temperature control for a chemical mechanical polishing system, comprising:
while a conditioner disk or conditioner head in the polishing system is spaced away from a polishing pad of the polishing system, directing a gas that includes steam from an orifice onto the conditioner disk or conditioner head to raise a temperature of the conditioner disk or conditioner head to an elevated temperature,
before the conditioner disk or conditioner head returns to an ambient temperature, moving the conditioner disk or conditioner head into contact with the polishing pad.

17. The method of claim 16 , wherein steam is directed onto the conditioner disk or conditioner head at a conditioner disk cleaning cup.

18. A chemical mechanical polishing system, comprising:
a platen to support a polishing pad;
a boiler;
a movable component;
a treatment station spaced from the polishing pad, the treatment station having a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when positioned in the treatment station;
an actuator to move the component from the treatment station into contact with the polishing pad;
a controller configured to
cause the treatment station to direct the steam onto the component to raise a temperature of the component to an elevated temperature, and
cause the actuator to move the component from the treatment station into contact with the polishing pad before the component returns to an ambient temperature.

19. The system of claim 18 , wherein the component comprises a carrier head or a substrate.

20. The system of claim 18 , wherein the component comprises a conditioner head or conditioner disk.

Assignees

• Applied Materials Inc

Inventors

• Wu Haosheng
• Tang Jianshe
• Soundararajan Hari
• Chang Shou-Sung
• Butterfield Paul D
• Chen Hui
• Chou Chih Chung
• Fisher Alexander John

Classifications

• B08B3/00

  Cleaning by methods involving the use or presence of liquid or steam (B08B9/00 takes precedence) · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B41/061

  axially supporting turning workpieces, e.g. magnetically, pneumatically · CPC title

• B24B53/005 Primary

  Positioning devices for conditioning tools · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title