Grinding apparatus and method for manufacturing semiconductor device using the same
US-12564914-B2 · Mar 3, 2026 · US
Positioning devices for conditioning tools
Positioning devices for conditioning tools · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B53/005 |
| Official title | {Positioning devices for conditioning tools} |
| Display label | Positioning devices for conditioning tools |
| Total patents | 44 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 3 |
| 2018 | 7 |
| 2019 | 2 |
| 2020 | 7 |
| 2021 | 1 |
| 2022 | 3 |
| 2023 | 8 |
| 2024 | 1 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Finishing tool
US-2026042153-A1 · Feb 12, 2026 · US
In-situ conditioner disk cleaning during CMP
US-12459078-B2 · Nov 4, 2025 · US
In-situ conditioner disk cleaning during cmp
US-2025326086-A1 · Oct 23, 2025 · US
Chemical mechanical polishing correction tool
US-2025319569-A1 · Oct 16, 2025 · US
Polishing pad conditioner position detection module, polishing device, and polishing detection method using the position detection module
US-2025282023-A1 · Sep 11, 2025 · US
Chemical mechanical polishing correction tool
US-12365060-B2 · Jul 22, 2025 · US
Methods for conditioning polishing pads
US-2025091177-A1 · Mar 20, 2025 · US
Multi head pad conditioning apparatus and method of use
US-2024383099-A1 · Nov 21, 2024 · US
In-situ conditioner disk cleaning during cmp
US-2023390895-A1 · Dec 7, 2023 · US
Grinding apparatus and method for manufacturing semiconductor device using the same
US-2023339071-A1 · Oct 26, 2023 · US
Platen surface modification and high-performance pad conditioning to improve CMP performance
US-11794305-B2 · Oct 24, 2023 · US
Use of steam for pre-heating of cmp components
US-2023256562-A1 · Aug 17, 2023 · US
Method for CMP pad conditioning
US-11679472-B2 · Jun 20, 2023 · US
Use of steam for pre-heating of CMP components
US-11633833-B2 · Apr 25, 2023 · US
Conditioner and chemical mechanical polishing apparatus including the same
US-11577364-B2 · Feb 14, 2023 · US
Substrate processing apparatus
US-11541502-B2 · Jan 3, 2023 · US
Chemical mechanical polishing correction tool
US-2022324081-A1 · Oct 13, 2022 · US
Platen surface modification and high-performance pad conditioning to improve cmp performance
US-2022097206-A1 · Mar 31, 2022 · US
Method and apparatus for monitoring chemical mechanical polishing process
US-11279001-B2 · Mar 22, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B53/005?
- CPC B24B53/005 is the Cooperative Patent Classification code for “Positioning devices for conditioning tools.”
- How many patents are filed under CPC B24B53/005 (Positioning devices for conditioning tools)?
- Our database includes 44 publications tagged with this CPC code.
- Is patent activity under CPC B24B53/005 growing?
- Publication counts under this code: 1 in 2024 vs 6 in 2025 (latest complete years).