Fluidic cavities for on-chip layering and sealing of separation arrays

US11612889B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11612889-B2
Application numberUS-202117162002-A
CountryUS
Kind codeB2
Filing dateJan 29, 2021
Priority dateFeb 13, 2019
Publication dateMar 28, 2023
Grant dateMar 28, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for fabricating a fluidic device includes depositing a sacrificial material on a pillar array arranged on a substrate. The method also includes removing a portion of the sacrificial material. The method further includes depositing a sealing layer on the pillar array to form a sealed fluidic cavity.

First claim

Opening claim text (preview).

What is claimed is: 1. A fluidic device comprising: a first pillar array arranged on a substrate, the first pillar array comprising a plurality of pillars and a plurality of extraction columns, each extraction column comprising an access opening, each access opening of each extraction column being a single slit within a sidewall of the extraction column; and a sealing layer arranged on the first pillar array to form a sealed fluidic cavity. 2. The fluidic device of claim 1 , wherein the fluidic device comprises a deterministic lateral displacement (DLD) device. 3. The fluidic device of claim 1 , wherein the sealing layer comprises an oxide. 4. The fluidic device of claim 1 further comprising a second pillar array arranged between the first pillar array and the sealing layer. 5. The fluidic device of claim 1 , wherein the first pillar array comprises an oxide. 6. The fluidic device of claim 5 , wherein the oxide is silicon dioxide. 7. A fluidic device comprising: a first pillar array arranged on a substrate, the first pillar array comprising a plurality of pillars and a plurality of extraction columns, each extraction column comprising an access opening each access opening of each extraction column being three slits within a sidewall of the extraction column; and a sealing layer arranged on the first pillar array to form a sealed fluidic cavity. 8. A fluidic device comprising: a first pillar array arranged on a substrate, the first pillar array comprising a plurality of pillars and a plurality of extraction columns, each extraction column comprising an access opening, each extraction column includes an inverted U-shaped structure; a sealing layer arranged on the first pillar array to form a sealed fluidic cavity; and an oxide layer arranged on the sealing layer, the oxide layer having a plurality of vent holes aligned over the plurality of extraction columns. 9. The fluidic device of claim 8 , wherein the fluidic device comprises a deterministic lateral displacement (DLD) device. 10. The fluidic device of claim 8 , wherein the sealing layer comprises an oxide. 11. The fluidic device of claim 8 further comprising a second pillar array arranged between the first pillar array and the sealing layer. 12. The fluidic device of claim 8 , wherein the first pillar array comprises an oxide. 13. The fluidic device of claim 12 , wherein the oxide is silicon dioxide. 14. The fluidic device of claim 8 , wherein the access opening of the inverted U-shaped structure faces a direction of fluid flow.

Assignees

Inventors

Classifications

  • with mechanical, e.g. inertial, classification, and investigation of sorted collections (with centrifuges G01N15/042) · CPC title

  • Specific details about materials · CPC title

  • Tips, pillars, i.e. raised structures (microneedles A61M37/0015) · CPC title

  • characterised by venting arrangements · CPC title

  • characterised by the manufacture of the container or its components · CPC title

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Frequently asked questions

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What does patent US11612889B2 cover?
A method for fabricating a fluidic device includes depositing a sacrificial material on a pillar array arranged on a substrate. The method also includes removing a portion of the sacrificial material. The method further includes depositing a sealing layer on the pillar array to form a sealed fluidic cavity.
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B01L3/502707. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 28 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).