Optical interconnections for hybrid testing using automated testing equipment
US-2022034963-A1 · Feb 3, 2022 · US
US11604219B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11604219-B2 |
| Application number | US-202017122570-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2020 |
| Priority date | Dec 15, 2020 |
| Publication date | Mar 14, 2023 |
| Grant date | Mar 14, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.
Opening claim text (preview).
What is claimed is: 1. A test system comprising: a test head; a device interface board (DIB) configured to connect to the test head, the DIB for holding devices under test (DUTs) and the DIB comprising electrical conductors for transmitting electrical signals between the DUTs and the test head; servers programmed to function as test instruments, the servers being external to, and remote from, the test head and being configured to communicate optical signals over fiber optic cables with the test head, the optical signals comprising serial signals; wherein the test head comprises a signal interface board, the signal interface board comprising a cable interface to connect to the fiber optic cables and an electrical interface to connect to the electrical conductors; wherein the signal interface board is configured to perform conversion between the optical signals and the electrical signals; and wherein the signal interface board is configured to condition, in an electrical domain, first ones of the electrical signals for output to the DIB by changing a timing of the first ones of the electrical signals so that the timing is consistent with a data stream protocol used on the DIB. 2. The test system of claim 1 , wherein the signal interface board is configured to amplify and to re-time second ones of the electrical signals from the DIB prior to conversion of the second ones of the electrical signals to optical signals. 3. The test system of claim 1 , wherein the signal interface board is configured to increase a signal power of the first ones of the electrical signals. 4. The test system of claim 1 , wherein the serial signals comprise real-time serial scan test vectors. 5. The test system of claim 4 , wherein the real-time serial scan test vectors are provided to pins of a DUT connected to the DIB in a form of the first ones of the electrical signals. 6. The test system of claim 1 , further comprising: an isolation power supply that is external to the test head, the isolation power supply to provide power from a location of the servers to the test head. 7. The test system of claim 6 , wherein the electrical signals in the test head are referenced with respect to an instrument ground; and wherein the instrument ground acts as a ground reference for the isolation power supply. 8. The test system of claim 1 , wherein one or more of the fiber optic cables are two meters (2 m) long or greater than 2 m long. 9. The test system of claim 1 , wherein the optical signals are transmitted at five gigabits-per-second (5 Gbps) or at greater than 5 Gbps. 10. The test system of claim 1 , wherein the serial signals represent pulsed digital signals. 11. The test system of claim 1 , wherein the test head is devoid of test electronics. 12. The test system of claim 1 , wherein the test head includes test electronics. 13. The test system of claim 1 , wherein the servers comprise general-purpose computing devices that are programmed to function as test instruments. 14. The test system of claim 1 , wherein the serial signals comprise USB-protocol digital signals. 15. A test system comprising: means for connecting electrically and mechanically to devices under test (DUTs), the means for connecting comprising a device interface board (DIB), the DIB comprising electrical conductors over which electrical signals pass; means for conditioning the electrical signals which are obtained by conversion from optical signals, the means for conditioning comprising a test head; and means for generating test vectors that are converted to optical signals for transmission over fiber optic cable, the means for generating comprising one or more general-purpose servers that are remote from a point of connection to the DUTs; wherein the test head comprises a signal interface board, the signal interface board comprising a cable interface to connect to the fiber optic cable and an electrical interface to connect to the electrical conductors; wherein the signal interface board is configured to perform conversion between the optical signals and the electrical signals; and wherein the signal interface board is configured to condition, in an electrical domain, first ones of the electrical signals for output to the DIB by changing a timing of the first ones of the electrical signals so that the timing is consistent with a data stream protocol used on the DIB. 16. The test system of claim 15 , wherein the test head is devoid of a test instrument or test electronics. 17. The test system of claim 15 , further comprising: an isolation power supply that is external to the test head, the isolation power supply to provide power from a location of means for generating to the test head; wherein the electrical signals in the test head are referenced with respect to an instrument ground; and wherein the instrument ground acts as a ground reference for the isolation power supply.
related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads · CPC title
using signal generators, power supplies or circuit analysers (G01R31/2879 takes precedence; multimeters G01R15/12, network analysers G01R27/28) · CPC title
Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks · CPC title
Automated test systems [ATE]; using microprocessors or computers (G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736) · CPC title
Measuring leads; Measuring probes (G01R19/145, G01R19/165 take precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.