Structure for transmitting signals in an application space between a device under test and test electronics

Patent metadata

Field	Value
Publication number	US-9594114-B2
Application number	US-201414316164-A
Country	US
Kind code	B2
Filing date	Jun 26, 2014
Priority date	Jun 26, 2014
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

An example structure for transmitting signals in an application space between a device under test (DUT) and test electronics includes: a circuit board that is part of an application space between test electronics and a device under test (DUT); and a coaxial structure to pass signals along electrical pathways between the test electronics and the DUT. The coaxial structure includes a signal line at least partially surrounded by a return line.

First claim

What is claimed is:

1. An apparatus comprising:
a circuit board that is part of an application space between test electronics and a device under test (DUT); and
a coaxial structure to pass signals along electrical pathways between the test electronics and the DUT, the coaxial structure comprising conduits, the conduits comprising a signal line at least partially surrounded by a return line, the coaxial structure comprising multiple stacked layers of conductive material, at least some of the conduits being curved or serpentine conduits configured so that, for the at least some of the conduits, one or more of the following substantially match: electrical path length, impedance, or signal attenuation.

2. The apparatus of claim 1 , wherein, in the coaxial structure, the signal line is completely surrounded by the return line.

3. The apparatus of claim 1 , wherein, in the coaxial structure, the signal line is partially, but not completely, surrounded by the return line.

4. The apparatus of claim 1 , wherein the coaxial structure passes through the circuit board.

5. The apparatus of claim 1 , wherein the multiple stacked layers of conductive material are stacked vertically.

6. The apparatus of claim 1 , wherein the coaxial structure comprises a manufactured structure.

7. The apparatus of claim 1 , wherein the DUT comprises transceivers, each of the transceivers comprising devices for transmitting and receiving signals; and
wherein the coaxial structure comprises a switching matrix for selecting transceiver channels for test.

8. The apparatus of claim 1 , wherein the coaxial structure comprises at least one of active elements or passive elements.

9. The apparatus of claim 8 , wherein the active elements or passive elements are an integral part of the coaxial structure.

10. The apparatus of claim 8 , wherein the active elements or passive elements comprise discrete components attached to integral parts of the coaxial structure.

11. The apparatus of claim 1 , wherein the coaxial structure comprises at least one channel for holding or transferring thermal transmitting material, the at least one channel being positioned to thermally impact an active or passive device associated with the application space.

12. The apparatus of claim 10 , where the thermal transmitting material is configured to stabilize a temperature of an active or passive device within the application space, wherein stabilizing comprises cooling or heating the device to maintain a target temperature.

13. A system comprising:
devices under test (DUTs);
test electronics to test the DUTs; and
a coaxial structure to pass signals between the test electronics and the DUTs, the coaxial structure comprising conduits comprised of signal lines at least partially surrounded by respective return lines, the coaxial structure comprising curved or serpentine conduits configured so that, for at least some of the conduits, one or more of the following substantially match: electrical path length, impedance, or signal attenuation.

14. The system of claim 13 , wherein the coaxial structure is a first coaxial structure; and wherein the system further comprises:
a second coaxial structure to pass signals between the test electronics and the first coaxial structure; and
a third coaxial structure to pass signals between the first coaxial structure and the DUTs.

15. The system of claim 14 , wherein the circuit board comprises electrical elements arranged at a first pitch;
wherein the DUTs are on a wafer comprising contacts arranged at a second pitch, the second pitch being less than the first pitch; and
wherein the third coaxial structure comprises an interconnect comprising additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, the additively-manufactured electrical conduits comprising electrically-conductive material.

16. The system of claim 13 , wherein the at least some of the conduits are configured to have substantially matching electrical path lengths, impedance, and signal attenuation.

17. The system of claim 13 , wherein all of the conduits are configured to have substantially matching electrical path lengths, impedance, and signal attenuation.

18. The system of claim 13 , wherein, in the coaxial structure, a signal line is completely surrounded by a return line.

19. The system of claim 13 , wherein, in the coaxial structure, a signal line is not completely surrounded by a return line.

20. The system of claim 13 , wherein the coaxial structure comprises multiple layers of stacked conductive material.

21. The system of claim 20 , wherein the multiple layers of stacked conductive material are stacked vertically.

22. The system of claim 13 , wherein the coaxial structure comprises a machined structure.

23. The system of claim 13 , wherein the DUT comprises transceivers, each of the transceivers comprising devices for transmitting and receiving signals; and
wherein the coaxial structure comprises a switching matrix for selected ones of the transceivers for test.

24. The system of claim 13 , wherein the coaxial structure comprises at least one of active elements or passive elements.

25. The system of claim 24 , wherein the active elements or passive elements are an integral part of the coaxial structure.

26. The system of claim 24 , wherein the active elements or passive elements comprise discrete components attached to integral parts of the coaxial structure.

27. The system of claim 13 , wherein the coaxial structure comprises at least one channel for holding cooling liquid, the at least one channel being positioned to thermally impact an active or passive element associated with testing of a DUT.

Assignees

• Teradyne Inc

Inventors

• Sinsheimer Roger Allen

Classifications

• G01R31/2889 Primary

  Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence) · CPC title

• G01R31/31926

  Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing · CPC title

• G01R31/31905 Primary

  Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture · CPC title

• G01R31/2874

  related to temperature · CPC title

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title