Assembling devices for probe card testing

Patent metadata

Field	Value
Publication number	US-2016131702-A1
Application number	US-201414536928-A
Country	US
Kind code	A1
Filing date	Nov 10, 2014
Priority date	Nov 10, 2014
Publication date	May 12, 2016
Grant date	—

Abstract

An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice; and using a probe card that is matched to a pattern of dice in connection with the second wafer.

First claim

What is claimed is:

1 - 12 . (canceled)

13 . Automatic test equipment (ATE) comprising:
a probe card configured to contact, for testing, dice that have been cut from a first semiconductor wafer, the dice being on a second wafer; and a processing device to execute instructions to control testing performed by the probe card; wherein the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice.

14 . The ATE of claim 13 , further comprising an adhesive between the second wafer and the dice, the adhesive holding the dice on the second wafer.

15 . The ATE of claim 13 , wherein the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to heat.

16 . The ATE of claim 13 , wherein the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to ultraviolet light.

17 . The ATE of claim 13 , wherein a material of which the second wafer is formed comprises silicon having a coefficient of thermal expansion that matches a coefficient of thermal expansion of the dice or that is within a predefined range around the coefficient of thermal expansion of dice.

18 . The ATE of claim 13 , wherein the second wafer comprises glass on which an adhesive is disposed, and the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to ultraviolet light.

19 . The ATE of claim 13 , wherein the dice were in a same pattern in the first semiconductor wafer as the dice are arranged on the second wafer.

20 . The ATE of claim 13 , wherein the dice were in a first pattern in the first semiconductor wafer and the dice are in a second pattern on the second wafer, the first pattern being different from the second pattern.

21 . The ATE of claim 20 , wherein, in the second pattern, adjacent dice are farther apart than in the first pattern.

22 . The ATE of claim 13 , wherein the first semiconductor wafer was round and the second wafer has a shape that is other than round.

23 . The ATE of claim 13 , wherein the first semiconductor wafer or the second wafer has a shape that is other than round.

24 . The ATE of claim 13 , wherein the probe card is matched to a pattern of dice on the second wafer.

Assignees

• Teradyne Inc

Inventors

• Sinsheimer Roger Allen

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• G01R31/2834 Primary

  Automated test systems [ATE]; using microprocessors or computers (G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736) · CPC title