Reflow oven liner, system and method
US-2016339486-A1 · Nov 24, 2016 · US
Auxiliary devices therefor
Auxiliary devices therefor · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/08 |
| Official title | Auxiliary devices therefor |
| Display label | Auxiliary devices therefor |
| Total patents | 662 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 49 |
| 2016 | 49 |
| 2017 | 46 |
| 2018 | 50 |
| 2019 | 63 |
| 2020 | 70 |
| 2021 | 76 |
| 2022 | 58 |
| 2023 | 68 |
| 2024 | 59 |
| 2025 | 58 |
| 2026 | 16 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US-9478516-B2 · Oct 25, 2016 · US
Increasing solder hole-fill in a printed circuit board assembly
US-2016297022-A1 · Oct 13, 2016 · US
Bonding apparatus
US-2016284662-A1 · Sep 29, 2016 · US
Flux Recovery Device and Soldering Device
US-2016250705-A1 · Sep 1, 2016 · US
Increasing solder hole-fill in a printed circuit board assembly
US-9427828-B2 · Aug 30, 2016 · US
Apparatus and method for brazing
US-9370839-B2 · Jun 21, 2016 · US
Aluminum airfoil
US-2016153464-A1 · Jun 2, 2016 · US
Semi-automatic brazing device
US-9346115-B2 · May 24, 2016 · US
Electronic component mounting system, electronic component mounting method, and electronic component mounting machine
US-2016081243-A1 · Mar 17, 2016 · US
Apparatus for adsorbing solder ball and method of attaching solder ball using the same
US-2016016247-A1 · Jan 21, 2016 · US
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US-9221114-B2 · Dec 29, 2015 · US
Pre-heater latch and seal mechanism for wave solder machine and related method
US-2015367438-A1 · Dec 24, 2015 · US
Flux management system and method for a wave solder machine
US-9198300-B2 · Nov 24, 2015 · US
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US-2015322545-A1 · Nov 12, 2015 · US
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US-2015322540-A1 · Nov 12, 2015 · US
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US-2015321279-A1 · Nov 12, 2015 · US
Hot bar soldering
US-9180540-B1 · Nov 10, 2015 · US
Apparatus and method for manufacturing heat exchanger for vehicle
US-2015314405-A1 · Nov 5, 2015 · US
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US-9165902-B2 · Oct 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/08?
- CPC B23K3/08 is the Cooperative Patent Classification code for “Auxiliary devices therefor.”
- How many patents are filed under CPC B23K3/08 (Auxiliary devices therefor)?
- Our database includes 662 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/08 growing?
- Publication counts under this code: 59 in 2024 vs 58 in 2025 (latest complete years).