Composition for metal electroplating comprising leveling agent
US-9758885-B2 · Sep 12, 2017 · US
US11579344B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11579344-B2 |
| Application number | US-202016897531-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2020 |
| Priority date | Sep 17, 2012 |
| Publication date | Feb 14, 2023 |
| Grant date | Feb 14, 2023 |
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A metallic grating includes a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
Opening claim text (preview).
What is claimed is: 1. A metallic grating comprising: a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating comprising a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein an aspect ratio of the high aspect ratio trenches is from 0.5 to 200, and a height of the high aspect ratio trenches is from 50 nm to 5 mm, and a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches. 2. The metallic grating of claim 1 , wherein the substrate is electrically conductive. 3. The metallic grating of claim 1 , wherein the substrate comprises silicon and a dopant that provides electrical conductivity to the substrate. 4. The metallic grating of claim 1 , wherein a width of the metallic superconformal filling is from 10 nm to 100 μm. 5. The metallic grating of claim 1 , wherein a length of the metallic superconformal filling is from 0.5 μm to 1 m. 6. The metallic grating of claim 1 , wherein the height of the metallic superconformal filling is from 50 nm to 5 mm. 7. The metallic grating of claim 1 , wherein the metallic superconformal filling consists essentially of gold and bismuth.
using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams · CPC title
using mechanical means, e.g. ruling with diamond tool, moulding · CPC title
with pitch less than or comparable to the wavelength · CPC title
Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials (G02B5/1809, G02B5/1828, G02B5/1833, G02B5/1838 and G02B5/1847 take precedence) · CPC title
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