Process for hysteretic current-voltage mediated void-free superconformal and bottom-up filling
US-2024229282-A1 · Jul 11, 2024 · US
Moffat Thomas Polk is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Moffat Thomas Polk |
| Total patents | 5 |
| First publication | Sep 24, 2020 |
| Latest publication | Jul 11, 2024 |
Publications ranked by popularity score, then publication date.
US-2024229282-A1 · Jul 11, 2024 · US
US-11733439-B2 · Aug 22, 2023 · US
US-11579344-B2 · Feb 14, 2023 · US
US-2023037933-A1 · Feb 9, 2023 · US
US-2020301051-A1 · Sep 24, 2020 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Government Of The Us Secretary Of Commerce | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B5/1852 | 4 |
| G02B5/1809 | 4 |
| G02B5/1857 | 4 |
| G02B5/1861 | 4 |
| H10P14/47 | 1 |