Conditioner and chemical mechanical polishing apparatus including the same

Patent metadata

Field	Value
Publication number	US-11577364-B2
Application number	US-201816225089-A
Country	US
Kind code	B2
Filing date	Dec 19, 2018
Priority date	May 28, 2018
Publication date	Feb 14, 2023
Grant date	Feb 14, 2023

Abstract

A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.

First claim

What is claimed is:

1. A conditioner of a chemical mechanical polishing (CMP) apparatus, the conditioner comprising:
a conditioning unit to polish a polishing pad;
an arm having a first end and a second end, the first end allowing the arm to pivot about a first axis, the conditioning unit connected to the second end and rotatable about a second axis that is offset from the first axis; and
a flexible connection unit connecting the conditioning unit with the second end of the arm, the flexible connection unit being moveable to allow relative tilting movements about the second axis of the conditioning part with respect to the arm, and the flexible connection unit including:
a first fixing member fixed to the second end of the arm,
a second fixing member fixed to the conditioning unit, and
a flexible connection member connected between the first fixing member and the second fixing member, the flexible connection member including:
an inner ring extending between and contacting the first fixing member and the second fixing member, and
an outer ring extending between and contacting the first fixing member and the second fixing member, the outer ring being radially spaced apart from the inner ring and completely surrounding the inner ring.

2. The conditioner as claimed in claim 1 , wherein the flexible connection member further includes an internal space between the inner ring and the outer ring, the internal space defining an air bag with a ring shape.

3. The conditioner as claimed in claim 1 , wherein the flexible connection member includes a bent portion in a sidewall thereof.

4. The conditioner as claimed in claim 2 , further comprising an air-supplier to supply air into the internal space.

5. The conditioner as claimed in claim 4 , wherein the air-supplier includes:
an air line connected to the internal space of the flexible connection member; and
a pressure controller to control a pressure of the air in the air line.

6. The conditioner as claimed in claim 5 , wherein the air line is connected to the internal space through an air hole in the first fixing member.

7. The conditioner as claimed in claim 6 , wherein the air line is within the arm.

8. The conditioner as claimed in claim 1 , further comprising a sensor to measure a tilted angle of the conditioning unit with respect to the arm.

9. The conditioner as claimed in claim 8 , wherein the sensor includes at least three sub-sensors arranged at the first fixing member to measure relative distances between the first fixing member and the second fixing member.

10. The conditioner as claimed in claim 1 , wherein the flexible connection member includes upper and lower combining protrusions, and the first and second fixing members include upper and lower combining grooves to receive the upper and lower combining protrusions, respectively.

11. The conditioner as claimed in claim 1 , wherein the conditioning unit includes:
a conditioning disk to polish the polishing pad;
a first actuator to rotate the conditioning disk; and
a second actuator connected with the flexible connection unit to lift the first actuator.

12. The conditioner as claimed in claim 11 , wherein the conditioning unit further includes a heat dissipation member arranged on the conditioning disk.

13. The conditioner as claimed in claim 1 , further comprising a third actuator to rotate the arm with the flexible connection unit.

14. A chemical mechanical polishing (CMP) apparatus, comprising:
a plurality of platens including polishing pads;
a CMP part arranged over the platens to polish a substrate; and
a conditioner including:
a conditioning unit to polish a polishing pad of the polishing pads,
an arm having a first end and a second end, the first end allowing the arm to pivot about a first axis, the conditioning unit connected to the second end and rotatable about a second axis that is offset from the first axis, and

a flexible connection unit connecting the conditioning unit with the second end of the arm, the flexible connection unit being moveable to allow relative titling movements about the second axis of the conditioning part with respect to the arm, and the flexible connection unit including:
a first fixing member fixed to the second end of the arm,
a second fixing member fixed to the conditioning unit, and
a flexible connection member connected between the first fixing member and the second fixing member, the flexible connection member including:
an inner ring extending between and contacting the first fixing member and the second fixing member, and

an outer ring extending between and contacting the first fixing member and the second fixing member, the outer ring being radially spaced apart from the inner ring and completely surrounding the inner ring.

15. The CMP apparatus as claimed in claim 14 , wherein the CMP part includes:
a substrate holder to hold the substrate; and
a spindle unit including at least two docking faces selectively combined with at least two docking units to transmit a rotary force and a pressure from the docking units to the substrate holder.

16. The CMP apparatus as claimed in claim 15 , wherein the spindle unit includes:
at least two couplers connected with the docking units;
driving bevel gears connected with the couplers;
a driven bevel gear engaged with the driving bevel gears; and
a rotary union arranged between the driven bevel gear and the substrate holder to transmit the rotary force to the substrate holder.

17. The CMP apparatus as claimed in claim 16 , wherein the rotary union is connected to a pneumatic line through which the pressure is transferred.

18. The CMP apparatus as claimed in claim 14 , wherein the platens are arranged in at least two rows, at least two guide rails for moving the CMP part are arranged in the rows, and a connection rail is connected between the guide rails.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Yong-Hee
• Han Seung-Chul
• Lee Hui-Gwan
• Seo Jong-Hwi

Classifications

• B24B53/005 Primary

  Positioning devices for conditioning tools · CPC title

• B24B49/12

  involving optical means · CPC title

• B24B37/105

  the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement · CPC title

• B24B49/105

  using eddy currents · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title