Method for manufacturing high purity tin, electrowinning apparatus for high purity tin and high purity tin

US11572632B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11572632-B2
Application numberUS-201916674676-A
CountryUS
Kind codeB2
Filing dateNov 5, 2019
Priority dateOct 2, 2014
Publication dateFeb 7, 2023
Grant dateFeb 7, 2023

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Provided is a method for manufacturing high purity tin including: depositing electrodeposited tin on the surface of a cathode by electrowinning in an electrolytic bath in which a diaphragm is placed between an anode and the cathode, by using a raw material for tin as the anode and a leachate obtained by electrolytically leaching the raw material for tin in a sulfuric acid solution as an electrolytic solution, the electrolytic solution containing a smoothing agent for improving a surface property of the electrodeposited tin; discharging the electrolytic solution from the electrolytic bath such that lead in the discharged electrolytic solution is removed; and putting the electrolytic solution from which lead is removed back into the electrolytic bath.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing high purity tin having a purity of 5N or higher, the method comprising: electrodepositing tin on a surface of a cathode by electrowinning in an electrolytic bath in which a diaphragm is placed between an anode and the cathode, by using a raw material for tin as the anode and a leachate obtained by electrolytically leaching the raw material for tin in a sulfuric acid solution as an electrolytic solution, wherein the electrolytic solution contains a smoothing agent, discharging the electrolytic solution from the electrolytic bath, removing lead from the discharged electrolytic solution by a coprecipitation of adding coprecipitating agent containing strontium ion, and then performing a solid-liquid separation of the discharged electrolytic solution from which the lead is removed, and putting the electrolytic solution from which lead is removed back into the electrolytic bath. 2. The method for manufacturing high purity tin according to claim 1 , which comprises: discharging the electrolytic solution into an anode side chamber in the electrolytic bath in which the anode is placed, removing lead from the discharged electrolytic solution, and putting the electrolytic solution from which lead is removed back into a cathode side chamber in the electrolytic bath in which the cathode is placed. 3. The method for manufacturing high purity tin according to claim 1 , wherein the smoothing agent comprises a nonionic surfactant which is a compound having an aryl group with one or more hydroxyl groups, the one or more hydroxyl groups being connected to the aryl group via methylene or a plurality of ethylene oxides. 4. The method for manufacturing high purity tin according to claim 1 , wherein the smoothing agent comprises a polyoxyethylene alkyl phenyl ether. 5. The method for manufacturing high purity tin according to claim 1 , which employs the raw material for tin with a purity of 4N (99.99%) or higher, the purity excluding the gas components of O, C, N and H. 6. The method for manufacturing high purity tin according to claim 1 , wherein the content of lead in the raw material for tin is 20 ppm or less. 7. The method for manufacturing high purity tin according to claim 1 , wherein an electrodeposited tin of high purity composed of a plate crystal is obtained. 8. The method for manufacturing high purity tin according to claim 1 , wherein 1 to 30 g/L of the coprecipitating agent is added. 9. The method for manufacturing high purity tin according to claim 1 , wherein the coprecipitation agent comprises strontium carbonate. 10. The method for manufacturing high purity tin according to claim 1 , the electrolytic solution contains 1 to 20 g/L of the smoothing agent.

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What does patent US11572632B2 cover?
Provided is a method for manufacturing high purity tin including: depositing electrodeposited tin on the surface of a cathode by electrowinning in an electrolytic bath in which a diaphragm is placed between an anode and the cathode, by using a raw material for tin as the anode and a leachate obtained by electrolytically leaching the raw material for tin in a sulfuric acid solution as an electro…
Who is the assignee on this patent?
Jx Nippon Mining & Metals Corp
What technology area does this patent fall under?
Primary CPC classification C25C1/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).