Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
US2021381082A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021381082-A1 |
| Application number | US-202017287205-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 27, 2020 |
| Priority date | Mar 4, 2019 |
| Publication date | Dec 9, 2021 |
| Grant date | — |
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In the present invention, a high-purity metallic tin suitable for use in an EUV exposure device is provided through use of an oxidation-resistant metallic tin, the oxidation-resistant metallic tin containing 99.995 mass % or more of tin, and unavoidable impurities, and the thickness of an oxide film being 2.0 nm or less when the surface of a cut face of the oxidation-resistant metallic tin is measured by AES.
Opening claim text (preview).
1 . An oxidation-resistant metallic tin comprising at least 99.995% by weight of tin, and inevitable impurities, wherein the thickness of an oxide film as measured by AES on a surface of a cutting face is 2.0 nm or less. 2 . The oxidation-resistant metallic tin according to claim 1 , wherein the thickness of the oxide film on the surface of the cutting face as measured by AES upon starting the measurement after atmospheric exposure for 72 hours immediately after cutting is 2.0 nm or less. 3 . The oxidation-resistant metallic tin according to claim 1 , wherein the thickness of the oxide film as measured by AES is 1.2 nm or less. 4 . The oxidation-resistant metallic tin according to claim 1 , wherein the oxidation-resistant metallic tin comprises 99.999% by weight of tin, and inevitable impurities. 5 . The oxidation-resistant metallic tin according to claim 1 , wherein as the inevitable impurities, the content of Mn is less than 0.005 ppm, the content of Fe is less than 0.005 ppm, the content of Sb is less than 0.5 ppm, and the content of S is less than 0.01 ppm. 6 . An oxidation-resistant metallic tin packaging body obtained by vacuum-packing the oxidation-resistant metallic tin according to claim 1 . 7 . An oxidation-resistant metallic tin packaging body obtained by vacuum-packing the oxidation-resistant metallic tin according to claim 2 . 8 . An oxidation-resistant metallic tin packaging body obtained by vacuum-packing the oxidation-resistant metallic tin according to claim 3 . 9 . An oxidation-resistant metallic tin packaging body obtained by vacuum-packing the oxidation-resistant metallic tin according to claim 4 . 10 . An oxidation-resistant metallic tin packaging body obtained by vacuum-packing the oxidation-resistant metallic tin according to claim 5 .
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