Printing components to substrate posts

Patent metadata

Field	Value
Publication number	US-11528808-B2
Application number	US-201816207665-A
Country	US
Kind code	B2
Filing date	Dec 3, 2018
Priority date	Dec 3, 2018
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

First claim

What is claimed:

1. A method of printing, comprising:
providing a transfer device that is a stamp comprising PDMS and stamp posts, a patterned substrate, and a component source wafer comprising components that are resonators or transducers, wherein the patterned substrate comprises substrate posts that protrude from a horizontal surface of the patterned substrate;
picking up the components from the component source wafer by adhering the components to the stamp posts; and
printing one or more of the picked-up components to the patterned substrate by disposing each of the one or more picked-up components onto only one of the substrate posts without deforming the one of the substrate posts, thereby providing one or more printed components in a printed structure,
wherein each of the one or more picked-up components comprises a broken or separated tether and each of the substrate posts has at least one horizontal dimension smaller than a corresponding dimension of the component printed onto the substrate post.

2. The method of claim 1 , wherein each of the printed one or more of the picked-up components is a first picked-up component and one or more of the picked-up components other than the first picked-up components is a second picked-up component and the method comprises moving the transfer device relative to the patterned substrate and printing to the patterned substrate by disposing each of the one or more second picked-up components onto one of the substrate posts.

3. The method of claim 2 , comprising:
moving the transfer device relative to the patterned substrate after printing the first picked-up components; and
printing the second picked-up components to the patterned substrate without picking up any components additional to the first and second picked-up components.

4. The method of claim 1 , wherein each of the picked-up components comprises a fractured component tether.

5. The method of claim 1 , wherein the transfer device picks up every component on the component source wafer.

6. The method of claim 1 , wherein the transfer device picks up a subset of the components on the component source wafer.

7. The method of claim 1 , wherein the transfer device picks up every component on the component source wafer within a simple closed curve on the component source wafer.

8. The method of claim 6 , wherein the subset of picked-up components is a regular rectangular array of components.

9. The method of claim 1 , wherein all of the picked-up components are printed.

10. The method of claim 1 , wherein a subset of the picked-up components is printed and no picked-up components that are not in the subset of picked-up components are between the picked-up components that are in the subset of the picked-up components.

11. The method of claim 1 , wherein a subset of the picked-up components is printed and the picked-up components that are in the subset of picked-up components are not all adjacent to each other.

12. The method of claim 1 , wherein the substrate posts are disposed in a regular rectangular array.

13. The method of claim 1 , wherein the picked-up components are separated by a component separation distance in each of one or two dimensions and the substrate posts are separated by a substrate post distance in each of one or two dimensions, wherein the substrate post separation distance is greater than the component separation distance in the corresponding dimension.

14. The method of claim 1 , wherein, for at least one of the one or more printed components, the one printed component extends over an edge of the one of the substrate posts.

15. The method of claim 14 , wherein at least one of the substrate posts forms a ridge that extends in one direction beyond one of the one or more printed components printed on the substrate post in a direction parallel to the horizontal surface.

16. The method of claim 15 , wherein more than one of the one or more printed components are printed on a single ridge.

17. The method of claim 1 , wherein, for each of the one or more printed components, the one of the substrate posts is disposed between a center of the printed component and the substrate.

18. The method of claim 1 , wherein each of the one or more components is adhered to the one of the substrate posts.

19. The method of claim 1 , wherein one of the picked-up components is disposed directly on the stamp post after being picked up, and the stamp post has a dimension the same as a corresponding dimension of at least one of the substrate posts.

20. The method of claim 1 , comprising:
disposing a solder between each of the one or more printed components and the one of the substrate posts; and
heating the solder to electrically connect a substrate post electrode on the substrate post to a component electrode on the component.

21. The method of claim 1 , comprising (i) wire bonding a wire to a component electrode on each of the one or more printed components, (ii) wire bonding a wire to a substrate post electrode on the one of the substrate posts, or (iii) both (i) and (ii).

22. The method of claim 1 , comprising printing a subset of the one or more picked-up components on to ones of the substrate posts.

23. The method of claim 1 , wherein the printed structure is a printable module comprising at least a portion of a module tether connected to the patterned substrate.

24. The method of claim 1 , wherein each of the substrate posts comprises a dielectric or a semiconductor.

25. The method of claim 1 , wherein the components each comprise a piezoelectric material.

Assignees

• X Display Company Tech Ltd

Inventors

• Gomez David
• Bower Christopher Andrew
• Gul Raja Fazan
• Trindade António José Marques
• Cok Ronald S

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P95/11

  Separation of active layers from substrates · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title