Bonded wafer and method for producing bonded wafer
US-2024379899-A1 · Nov 14, 2024 · US
Adhesive wafer bonding with controlled thickness variation
US2015028362A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015028362-A1 |
| Application number | US-201313952450-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 26, 2013 |
| Priority date | Jul 26, 2013 |
| Publication date | Jan 29, 2015 |
| Grant date | — |
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Abstract
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A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of forming an array of micro devices comprising: patterning a device layer to form an array of micro device mesa structures over a handle substrate; forming a patterned sacrificial layer including an array of openings over the corresponding array of micro device mesa structures; forming a stabilization layer over the patterned sacrificial layer and within the array of openings; and bonding the stabilization layer to a spacer side of a carri…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2015028362A1 cover?
- A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
- Who is the assignee on this patent?
- Luxvue Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification H10H20/018. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jan 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).