Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9178123B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178123-B2 |
| Application number | US-201213710443-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2012 |
| Priority date | Dec 10, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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Official abstract text for this publication.
Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
Opening claim text (preview).
What is claimed is: 1. A reflective bank structure comprising: a substrate; an insulating layer on the substrate; an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls; a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting diode device in the array of vertical light emitting diode devices has a maximum width of 1 μm-100 μm and inclu…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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