Method of fabricating a light emitting diode display with integrated defect detection test

Patent metadata

Field	Value
Publication number	US-9252375-B2
Application number	US-201313842925-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

First claim

What is claimed is:

1. A method of forming a display panel comprising:
transferring an array of micro LED devices from one or more carrier substrates to a corresponding array of bottom electrodes within a corresponding array of subpixels on a display substrate;
imaging a surface of the display substrate with a camera to detect irregularities in the array of micro LED devices selected from the group consisting of missing micro LED devices and contaminated micro LED devices; and
forming a passivation layer material over a plurality of the irregularities to electrically insulate the plurality of the irregularities.

2. The method of claim 1 , further comprising forming one or more top electrode layers in electrical contact with the array of micro LED devices without making electrical contact to the plurality of the irregularities.

3. The method of claim 1 , wherein an image produced from the camera is used to detect missing micro LED devices.

4. The method of claim 1 , wherein imaging the surface of the display substrate comprises:
illuminating the surface of the display substrate with a light source to cause the array of micro LED devices to fluoresce; and
imaging the fluorescence of the array of micro LED devices with the camera.

5. The method of claim 1 , further comprising transferring a plurality of repair micro LED devices to the display substrate adjacent the plurality of the irregularities prior to forming the passivation layer material over the plurality of the irregularities.

6. The method of claim 5 , further comprising forming one or more top electrode layers in electrical contact with the array of micro LED devices and the plurality of repair micro LED devices, wherein the one or more top electrode layers do not make electrical contact with the plurality of the irregularities.

7. The method of claim 1 , wherein forming the passivation layer material over the plurality of the irregularities to electrically insulate the plurality of the irregularities comprises ink jet printing or screen printing.

8. The method of claim 2 , wherein forming the one or more top electrode layers in electrical contact with the array of micro LED devices comprises ink jet printing or screen printing.

9. The method of claim 2 , wherein forming the one or more top electrode layers comprises forming a plurality of separate top electrode layers in electrical contact with the array of micro LED devices.

10. The method of claim 9 , further comprising scribing one of the separate top electrode layers to cut off an electrical path to a ground line.

11. A method of forming a display panel comprising:
transferring an array of micro LED device pairs from one or more carrier substrates to a corresponding array of bottom electrodes within a corresponding array of subpixels on a display substrate;
imaging a surface of the display substrate to detect irregularities in the array of micro LED device pairs; and
forming a passivation layer material over a plurality of the irregularities to electrically insulate the plurality of the irregularities.

12. The method of claim 11 , further comprising forming one or more top electrode layers in electrical contact with the array of micro LED device pairs.

13. The method of claim 11 , wherein transferring the array of micro LED device pairs comprises:
transferring a first array of micro LED devices from a first area on a first carrier substrate to the display substrate; and
transferring a second array of micro LED devices from a second area on the first carrier substrate to the display substrate.

14. The method of claim 13 , wherein the second area does not overlap the first area.

15. The method of claim 11 , wherein transferring the array of micro LED device pairs comprises:
transferring a first array of micro LED devices from a first carrier substrate to the display substrate; and
transferring a second array of micro LED devices from a second carrier substrate to the display substrate.

16. The method of claim 11 , wherein transferring the array of micro LED device pairs comprises transferring each micro LED device with a separate electrostatic transfer head.

17. The method of claim 11 , wherein imaging the surface of the display substrate comprises imaging the surface with a camera.

18. The method of claim 17 , wherein an image produced from the camera is used to detect irregularities in the array of micro LED device pairs selected from the group consisting of missing micro LED devices and contaminated micro LED devices.

19. The method of claim 17 , wherein the camera is a line scan camera.

20. The method of claim 17 , wherein imaging the surface of the display substrate comprises:
illuminating the surface of the display substrate with a light source to cause the array of micro LED device pairs to fluoresce; and
imaging the fluorescence of the array of micro LED device pairs with the camera.

21. The method of claim 20 , wherein an image produced from the camera is used to detect defective micro LED devices.

22. The method of claim 11 , further comprising transferring a plurality of repair micro LED devices to the display substrate adjacent the plurality of the irregularities prior to forming the passivation layer material over the plurality of the irregularities.

23. The method of claim 22 , further comprising forming one or more top electrode layers in electrical contact with the array of micro device pairs and the plurality of repair micro LED devices, wherein the one or more top electrode layers do not make electrical contact with the plurality of the irregularities.

24. The method of claim 12 , wherein forming the one or more top electrode layers in electrical contact with the array of micro LED device pairs comprises forming a single top electrode layer over the array of micro LED device pairs, wherein the single top electrode layer does not make electrical contact with the detected irregularities in the array of micro LED device pairs.

25. The method of claim 12 , wherein forming the one or more top electrode layers in electrical contact with the array of micro LED device pairs comprises forming a plurality of separate top electrode layers over the array of micro LED device pairs, wherein the plurality of separate top electrode layers do not make electrical contact with the detected irregularities in the array of micro LED device pairs.

26. The method of claim 25 , wherein the plurality of separate top electrode layers are formed directly over the detected irregularities in the array of micro LED device pairs.

27. The method of claim 25 , wherein the plurality of separate top electrode layers are not formed directly over the detected irregularities in the array of micro LED device pairs.

Assignees

• Luxvue Technology Corp

Inventors

• Bibl Andreas
• Sakariya Kapil V
• Griggs Charles R
• Perkins James Michael

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title