Insulation jacket for top coil of an isolated transformer

Patent metadata

Field	Value
Publication number	US-11450469-B2
Application number	US-201916553954-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Aug 28, 2019
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

First claim

What is claimed is:

1. A micro-isolator with enhanced isolation breakdown voltage, comprising:
a substrate;
a first isolator element distal from the substrate;
a second isolator element proximate the substrate;
a first dielectric material, comprising a polymer, disposed between the first and second isolator elements; and
a second dielectric material encapsulating the first isolator element.

2. The micro-isolator of claim 1 , wherein the first dielectric material comprises polyimide and the second dielectric material comprises a material with a bandgap wider than a bandgap of the first dielectric material.

3. The micro-isolator of claim 1 , wherein the first dielectric material has a thickness between 1 and 100 microns.

4. The micro-isolator of claim 1 , wherein the second dielectric material has a thickness between 0.1 and 5 microns.

5. The micro-isolator of claim 1 , wherein the first isolator element and the second isolator element are at least one of coils or capacitive plates.

6. The micro-isolator of claim 1 , further comprising an adhesion layer between the first isolator element and the second dielectric material.

7. The micro-isolator of claim 1 , wherein the second isolator element is disposed within the first dielectric material.

8. The micro-isolator of claim 1 , wherein the first isolator element further comprises a first side and a second opposing side, and the second dielectric material is thinner on the first side of the first isolator element than on the second opposing side of the first isolator element.

9. A micro-isolator with enhanced isolation breakdown voltage, comprising:
a first isolator element;
a second isolator element;
a first dielectric material disposed between the first and second isolator elements; and
a second dielectric material comprising disconnected portions disposed at outer corners of the second isolator element, the second dielectric material having a wider bandgap than the first dielectric material.

10. The micro-isolator of claim 9 , wherein the second dielectric material has a thickness between 0.1 and 5 microns.

11. The micro-isolator of claim 9 , wherein the first isolator element and the second isolator element are at least one of coils or capacitive plates.

12. The micro-isolator of claim 9 , further comprising an adhesion layer between the second isolator element and the second dielectric material.

13. The micro-isolator of claim 9 , wherein the second isolator element is disposed within the first dielectric material.

14. A micro-isolator with enhanced isolation breakdown voltage, comprising:
a first isolator element;
a second isolator element;
a first dielectric material disposed between the first and second isolator elements; and
a second dielectric material encapsulating the first isolator element, wherein the second dielectric material does not extend laterally beyond a maximum lateral dimension of the first isolator element.

15. The micro-isolator of claim 14 , wherein the first isolator element and the second isolator element are at least one of coils or capacitive plates.

16. The micro-isolator of claim 15 , wherein the first isolator element comprises a coil, the coil comprising windings, and wherein each winding is separated from another winding by a gap in the second dielectric material.

17. The micro-isolator of claim 14 , wherein the first dielectric material comprises a polymer and the second dielectric material comprises a material with a bandgap equal to or wider than a bandgap of the first dielectric material.

18. The micro-isolator of claim 14 , wherein the second dielectric material has a thickness between 0.1 and 5 microns.

19. The micro-isolator of claim 14 , wherein the second isolator element is disposed within the first dielectric material.

20. The micro-isolator of claim 9 , wherein the first dielectric material comprises a polymer.

Assignees

• Analog Devices Global Unlimited Co

Inventors

• Lambkin Paul
• Murphy Patrick J
• Stenson Bernard Patrick
• O'Sullivan Laurence B
• O'Brien Stephen
• Geary Shane
• Chen Baoxing
• Diaham Sombel

Classifications

• H10W20/47

  comprising two or more dielectric layers having different properties, e.g. different dielectric constants · CPC title

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H10W44/601

  Capacitive arrangements (H10W44/20 takes precedence) · CPC title

• H10W44/00

  Electrical arrangements for controlling or matching impedance · CPC title