Ground path systems for providing a shorter and symmetrical ground path

Patent metadata

Field	Value
Publication number	US-11434569-B2
Application number	US-201916400054-A
Country	US
Kind code	B2
Filing date	May 1, 2019
Priority date	May 25, 2018
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.

First claim

What is claimed is:

1. A ground path system, comprising:
a chamber having a processing volume;
a pedestal disposed in the processing volume by a stem coupled to a lift system configured to move the pedestal between an elevated processing position and a lowered position;
a ground bowl coupled to the pedestal in the processing volume and the stem, the stem disposed through an opening of the chamber;
a thermal barrier coupling the ground bowl to the pedestal;
a pumping plate disposed concentric to the pedestal in the processing volume:
a bottom bowl having a first portion disposed in the processing volume and a second portion disposed through the opening of the chamber; and
the bottom bowl is attached to a carrier, the carrier being coupled to a track, the bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position, the bottom bowl contacting the pumping plate in the ground position, the bottom bowl coupled to the ground bowl by a ground bowl conductor, and the bottom bowl coupled to the chamber by a bottom bowl conductor;
wherein the ground bowl and bottom bowl are movable with respect to each other and with respect to the lower wall of the chamber.

2. The system of claim 1 , wherein the stem coupled to a heater clamp that is coupled to a hub, the hub connected to the lift system.

3. The system of claim 2 , wherein the ground bowl in the elevated processing position and the bottom bowl in the ground position bifurcates the processing volume to form an inner volume of the processing volume isolated from an outer volume of the processing volume.

4. The system of claim 3 , further comprising a radio frequency (RF) source coupled to an electrode disposed within the pedestal through a RF matching circuit electrically coupled to the electrode by a conductive rod disposed through the hub and the stem.

5. The system of claim 4 , further comprising a faceplate disposed vertically above the pedestal.

6. The system of claim 5 , wherein the bottom bowl in the ground position contacts the pumping plate of the chamber to form a primary RF cage for RF energy to propagate from the faceplate to the RF matching circuit.

7. The system of claim 1 , wherein the ground bowl in the lowered position and the bottom bowl in the transfer position facilitate transfer of a substrate to and from the processing volume through a slit valve formed though the chamber.

8. A ground path system, comprising:
a chamber, the chamber having:
a processing volume; and
a pedestal disposed in the processing volume by a stem coupled to a hub connected to a lift system configured to move the pedestal between an elevated processing position and a lowered position;
a pumping plate disposed concentric to the pedestal in the processing volume;
a ground bowl configured to be disposed in the chamber and coupled to the hub, the ground bowl coupled to the pedestal in the processing volume and the stem, the stem disposed through an opening of the chamber; and
a ground bowl conductor coupled to the ground bowl, the ground bowl conductor contacting the pumping plate in a compressed state when the pedestal and the ground bowl are in the elevated processing position and in an expanded state when the pedestal and ground bowl are in the lowered position;
wherein the ground bowl and bottom bowl are movable with respect to each other and with respect to the lower wall of the chamber.

9. The system of claim 8 , wherein the ground bowl in the elevated processing position bifurcates the processing volume to form an inner volume of the processing volume isolated from an outer volume of the processing volume.

10. The system of claim 9 , further comprising a radio frequency (RF) source coupled to an electrode disposed within the pedestal through a RF matching circuit electrically coupled to the electrode by a conductive rod disposed through the hub and the stem.

11. The system of claim 10 , further comprising a faceplate disposed vertically above the pedestal.

12. The system of claim 11 , wherein the ground bowl conductor is in a compressed state when the pedestal and the ground bowl in the elevated processing position contacts the pumping plate of the chamber to form a primary RF cage for RF energy to propagate from the faceplate to the RF matching circuit.

13. The system of claim 8 , wherein the ground bowl in the lowered position facilitates transfer of a substrate to and from the processing volume through a slit valve formed though the chamber.

14. The system of claim 8 , wherein a heater clamp is coupled to the hub.

15. A chemical vapor deposition (CVD) chamber, comprising:
a chamber body having a processing volume;
a pedestal disposed in the processing volume by a stem coupled to a hub connected to move the pedestal between an elevated processing position and a lowered position;
a pumping plate disposed concentric to the pedestal in the processing volume: and
a ground path system disposed in the chamber body, the ground path system comprising:
a ground bowl coupled to the stem and the pedestal by a thermal barrier and coupled to the hub, the ground bowl coupled to the pedestal in the processing volume and the stem, the stem disposed through an opening of the chamber;
a bottom bowl coupled to the ground bowl by a ground bowl conductor and coupled to the chamber by a bottom bowl conductor, the bottom bowl having a first portion disposed in the processing volume and a second portion disposed through the opening of the chamber; and
the bottom bowl is attached to a carrier, the carrier being, coupled to a track, the bottom bowl carrier configured to move linearly along the track to move the bottom bowl between a ground position and a transfer position, the bottom bowl contacting the pumping plate in the ground position;
wherein the ground bowl and bottom bowl are movable with respect to each other and with respect to the lower wall of the chamber.

16. The chamber of claim 15 , wherein the ground bowl in the elevated processing position and the bottom bowl in the ground position bifurcates the processing volume to form an inner volume of the processing volume isolated from an outer volume of the processing volume.

17. The chamber of claim 16 , further comprising a radio frequency (RF) source coupled to an electrode disposed within the pedestal through a RF matching circuit electrically coupled to the electrode by a conductive rod disposed through the hub and the stem.

18. The chamber of claim 17 , further comprising a faceplate disposed vertically above the pedestal.

19. The chamber of claim 18 , wherein the bottom bowl in the ground position contacts the pumping plate of the chamber to form a primary RF cage for RF energy to propagate from the faceplate to the RF matching circuit.

20. The chamber of claim 15 , wherein the ground bowl in the lowered position and the bottom bowl in the transfer position facilitate transfer of a substrate to and from the processing volume through a slit valve formed though the chamber body.

Assignees

• Applied Materials Inc

Inventors

• Nguyen Tuan Anh
• Schaller Jason M
• Hammond Iv Edward P
• Blahnik David
• Ulavi Tejas
• Bansal Amit Kumar
• Baluja Sanjeev
• Ma Jun
• Rocha Juan Carlos

Classifications

• H01R4/66

  Connections with the terrestrial mass, e.g. earth plate, earth pin · CPC title

• H01J37/32798

  Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus · CPC title

• C23C16/4586

  Elements in the interior of the support, e.g. electrodes, heating or cooling devices · CPC title

• C23C16/509 Primary

  using internal electrodes · CPC title

• H01J37/32091

  the radio frequency energy being capacitively coupled to the plasma · CPC title