Conformal manufacturing device and method for complex curved-surface electronic system

Patent metadata

Field	Value
Publication number	US-11424144-B2
Application number	US-201816340380-A
Country	US
Kind code	B2
Filing date	Apr 9, 2018
Priority date	Mar 22, 2018
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

The invention belongs to a related field of electronic manufacturing technology, and particularly relates to a conformal manufacturing device and a method for a complex curved-surface electronic system, the system includes a support platform and a six-degree-of-freedom spherical motor linkage platform, a 3D measurement module, a laser lift-off module, a curved-surface transfer printing module and a conformal jet printing module respectively mounted on the support platform and independently controllable, and specific structures and work modes of these key components are improved. The invention further discloses a corresponding manufacturing method. Through the invention, multiple process flows required in conformal manufacturing process of the complex curved-surface electronic system are effectively integrated into an integrated device, so as to realize conformal hybrid manufacturing of the rigid/flexible curved-surface electronic system with arbitrary area, and the invention has advantages of high precision, high efficiency and high automation, which greatly broadens the application scope of the curved-surface electronic manufacturing technology.

First claim

What is claimed is:

1. A conformal manufacturing device for hybrid manufacturing of a rigid or flexible curved-surface electronic component, the conformal manufacturing device comprising a support platform having a spherical motor linkage platform, a three-dimensional measurement module, a laser lift-off module, a curved-surface transfer printing module, and a conformal jet printing module respectively mounted on the support platform and being independently controllable, wherein:
the spherical motor linkage platform comprises a linkage platform planar motion portion and a spherical motor portion, wherein the linkage platform planar motion portion is directly disposed on the support platform and has an X-direction motion axis adapted to move along an X-axis direction and a Y-direction motion axis adapted to move along a Y-axis direction, wherein the spherical motor portion is continuously arranged on the linkage platform planar motion portion and moves along with the linkage platform planar motion portion, and wherein the spherical motor portion is adhered with a rigid curved-surface substrate or a curved-surface underlayment carrying a flexible curved-surface substrate and drives the rigid curved-surface substrate or the curved-surface underlayment to rotate to required postures in space;
the three-dimensional measurement module comprises a measurement sensor support frame, a measurement module planar motion portion, a three-dimensional laser measurement sensor, and a measurement light source, wherein the measurement sensor support frame is directly disposed on the support platform, wherein the measurement module planar motion portion is installed on the measurement sensor support frame and has a Y-direction measurement motion axis adapted to move along the Y-axis direction and a Z-direction measurement motion axis adapted to move along a Z-axis direction and wherein the three-dimensional laser measurement sensor is continuously installed on the measurement module planar motion portion, is moved to a required position along with the measurement module planar motion portion, and is configured to perform point cloud acquisition on the curved-surface substrate or the curved-surface underlayment adhered to the spherical motor portion in collaboration with the measurement light source, and then to generate a point cloud module to perform a matching calculation with a corresponding design model;
the laser lift-off module includes a laser, a peeling module planar motion portion, a peeling support clamp, and a peeling observation camera, wherein the laser is disposed under the support platform and is configured to emit laser radiation through a matched optical path portion, thereby peeling off an electronic component lithographically printed on a transparent rigid planar substrate from the transparent rigid planar substrate, wherein the peeling module planar motion portion is disposed above the laser and has an X-direction peeling motion axis adapted to move along the X-axis direction and a Y-direction peeling motion axis adapted to move along the Y-axis direction, wherein the peeling support clamp is continuously installed on the peeling module planar motion portion, is moved to a required position along with the peeling module planar motion portion, is configured to fix and clamp the electronic component lithographically printed on the planar substrate to execute a laser lift-off operation, and wherein the peeling observation camera is disposed near the peeling module planar motion portion and is configured to acquire position information of the peeling module planar motion portion in collaboration with a peeling light source;
the curved-surface transfer printing module comprises a transfer head support frame, a transfer printing module planar motion portion, a curved-surface transfer head, and a transfer printing positioning camera, wherein the transfer head support frame is directly disposed on the support platform, wherein the transfer printing module planar motion portion is installed on the transfer head support frame and has an X-direction transfer printing motion axis adapted to move along the X-axis and a Z-direction transfer printing motion axis adapted to move along the Z-axis, wherein the curved-surface transfer head is continuously installed on the transfer printing module planar motion portion, is moved to a required position along with the transfer printing module planar motion portion, and is configured to transfer print the electronic component peeled off by the laser lift-off module to the rigid or flexible curved-surface substrate, and wherein the transfer printing positioning camera is configured to acquire position information of the transfer printing module planar motion portion in collaboration with a transfer printing light source; and
the conformal jet printing module comprises a nozzle support frame, a jet printing module planar motion portion, a nozzle portion, a jet printing observation camera, and an ink droplet observation camera, wherein the nozzle support frame is disposed on the support platform along the Z-axis direction, wherein the jet printing module planar motion portion is installed on the nozzle support frame and has an X-direction jet printing motion axis adapted to move along the X-axis and a Z-direction jet printing motion axis adapted to move along the Z-axis, wherein the nozzle portion is continuously installed on the jet printing module planar motion portion, is moved to a required position along with the jet printing module planar motion portion, and is configured to continuously jet-print a paste on a surface of the electronic component transferred to the rigid or flexible curved-surface substrate so as to fabricate a conductive interconnection structure, wherein the jet printing observation camera is configured to acquire a jet printing trajectory and effect on the rigid or flexible curved-surface substrate in collaboration with a jet printing light source, and wherein the ink droplet observation camera is configured to acquire a state of an ink droplet sprayed by the nozzle portion in collaboration with an ink droplet observation light source.

2. The conformal manufacturing device as claimed in claim 1 , wherein during the point cloud acquisition, a position of the three-dimensional laser measurement sensor is adjusted constantly, and a spacing between three-dimensional laser measurement sensor and the rigid or flexible curved-surface substrate in the Z-axis direction remains unchanged.

3. The conformal manufacturing device as claimed in claim 1 , wherein the optical path portion is arranged on the support platform along the Z-axis direction through an optical path support frame, and is configured to shape, uniform, and adjust a direction of a laser beam emitted by the laser, a tail end of the optical path portion being located immediately above the peeling module planar motion portion.

4. The conformal manufacturing device as claimed in claim 3 , wherein a fine gridding mask is adopted to control a peeling laser intensity, whereby the number of laser irradiations and laser irradiation energy on the electronic component lithographically printed on the transparent rigid planar substrate are controlled by adjusting a gridding feature width and spacing of the fine gridding mask.

5. The conformal manufacturing device as claimed in claim 1 , wherein the curved-surface transfer head works in active-passive combination such that a preliminary multi-point active conformal with the rigid or flexible curved-surface substrate is achieved through a mechanical motion structure inside the curved-surface transfer head, and then a complete distributed passive conformal with the rigid or flexible curved-surface substrate is achieved based on a deformable thin-film of the curved-surface transfer head.

Assignees

• Univ Huazhong Science Tech

Inventors

• Huang Yongan
• Yin Zhouping
• Wu Hao
• Chen Jiankui
• Li Wenlong
• Bai Kun

Classifications

• H10P72/0451 Primary

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B33Y40/00

  Auxiliary operations or equipment, e.g. for material handling · CPC title

• B22F10/31

  Calibration of process steps or apparatus settings, e.g. before or during manufacturing · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title