Manufacturing apparatus for performing additive manufacturing of an electrical device

Patent metadata

Field	Value
Publication number	US-10667403-B2
Application number	US-201415512101-A
Country	US
Kind code	B2
Filing date	Sep 19, 2014
Priority date	Sep 19, 2014
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

First claim

The invention claimed is:

1. A manufacturing apparatus comprising:
means for holding a three-dimensional article on a placing surface;
means for moving the means for holding in a first direction and a second direction, the first direction and the second direction being directions parallel to the placing surface and different from each other;
means for forming each layer of multiple layers of the three-dimensional article, the means for forming being disposed within a range in which the means for holding can be moved;
means for mounting an electronic component on a layered workpiece formed by the means for forming, the means for mounting being disposed within the range in which the means for holding can be moved, the means for mounting including means for supplying a plurality of electronic components and means for picking up the electronic component from the means for supplying and placing the electronic component on the layered workpiece; and
means for controlling to sequentially move the means for holding from a working position of one of the means for forming or the means for mounting to a working position of the other of the means for forming or the means for mounting along a path determined based on a work process to perform additive manufacturing of an electrical device on the means for holding.

2. The manufacturing apparatus according to claim 1 ,
wherein the first direction and the second direction are directions orthogonal to each other, and
wherein the means for moving moves the means for holding in a third direction as well as the first and second directions, the third direction being orthogonal to the placing surface.

3. The manufacturing apparatus according to claim 2 , wherein the working positions of the means for forming and the means for mounting are fixed with respect to the third direction are positioned on a same plane.

4. The manufacturing apparatus according to claim 1 , wherein the means for forming includes means for ejecting a liquid material onto the three-dimensional article by droplet ejection.

5. The manufacturing apparatus according to claim 4 ,
wherein the three-dimensional article is a multilayer wiring board, and
wherein multiple of the means for forming are provided including at least means for forming a wiring pattern by firing a conductive material ejected onto the multilayer wiring board by the respective means for ejecting and means for forming an insulating layer by curing an insulating material ejected onto the multilayer wiring board by the respective means for ejecting.

6. The manufacturing apparatus according to claim 1 , wherein the means for forming and the means for mounting are each attachable to and detachable from a manufacturing apparatus main body.

7. The manufacturing apparatus according to claim 6 , wherein the means for controlling determines arrangement of the means for forming and the means for mounting with respect to a movement direction of the means for holding based on the work process such that the path is minimized in length.

Assignees

• Fuji Corp

Inventors

• Suzuki Masato
• Kawajiri Akihiro
• Fujita Masatoshi
• Tsukada Kenji
• Hashimoto Yoshitaka

Classifications

• H05K1/097 Primary

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• B29C67/0003

  Moulding articles between moving mould surfaces, e.g. turning surfaces · CPC title

• H05K3/1241

  by ink-jet printing or drawing by dispensing · CPC title

• H05K2203/107

  Using laser light · CPC title