Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices

Patent metadata

Field	Value
Publication number	US-10518490-B2
Application number	US-201313829723-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

First claim

What is claimed is:

1. A system for making a three-dimensional electronic or electromechanical device, said system comprising:
a three-dimensional printer configured to create a three-dimensional thermoplastic substrate of said electronic or electromechanical device by depositing a thermoplastic substrate material in a layer-by-layer fashion; and
a first machine comprising a wire-feed and cutting system and at least one energy source, the energy source comprising a rotary ultrasonic horn or rotary sonotrode, wherein the first machine is configured to heat the thermoplastic substrate to a flowable state and embed at least a portion of a filament or a filament mesh within a layer of the thermoplastic substrate material such that said portion of said filament or said filament mesh is flush with a top surface of the layer and a portion of the thermoplastic substrate material in the flowable state is displaced by the portion of the filament or said filament mesh and wherein said portion of said filament or said filament mesh that displaces said substrate material does not protrude above the top surface of the layer, and wherein said filament or said filament mesh comprises a solid conductor.

2. The system as recited in claim 1 , wherein:
the three-dimensional printer comprises a fused deposition modeling (FDM) machine or other extrusion-based additive manufacturing machine, a selective laser sintering (SLS) machine or other powder bed fusion additive manufacturing process, a sheet lamination additive manufacturing process utilizing thermoplastic sheets, a stereolithography machine or other vat photopolymerization additive manufacturing process utilizing photocurable thermoplastics, a material jetting machine utilizing photocurable thermoplastics, or other additive thermoplastic-based 3D printing machine.

3. The system as recited in claim 2 , wherein the three-dimensional printer further deposits at least an additional layer of the thermoplastic substrate material such that all or a part of the portion of the filament or said filament mesh is covered by the additional layer.

4. The system as recited in claim 1 , further comprising:
a component placement machine configured to place a first component on or within the layer;
a first end of the filament or said filament mesh is proximate to the first component; and
a third machine configured to attach the first end of the filament or said filament mesh to the first component.

5. The system as recited in claim 4 , wherein the third machine comprises a laser micro-welding machine.

6. The system as recited in claim 4 wherein the third machine comprises a resistance welding machine.

7. The system as recited in claim 4 wherein the third machine comprises an ultrasonic welding machine.

8. The system as recited in claim 4 wherein the third machine comprises a wire bonding machine.

9. The system as recited in claim 1 wherein the three-dimensional printer comprises a fused deposition modeling (FDM) machine and wherein the filament or said filament mesh comprises at least one of a conductive plane, a mechanical reinforcement and an electromagnetic shield.

10. The system as recited in claim 1 wherein the three-dimensional printer comprises a selective laser sintering (SLS) machine and wherein the filament or said filament mesh comprises at least one of a conductive plane, a mechanical reinforcement and an electromagnetic shield.

11. The system as recited in claim 1 wherein the three-dimensional printer implements a powder bed fusion additive manufacturing process and wherein the filament or said filament mesh comprises at least one of a conductive plane, a mechanical reinforcement and an electromagnetic shield.

12. The system as recited in claim 1 wherein the three-dimensional printer comprises a stereolithography machine that utilizes stereolithography, which includes a fabrication process in which a laser is used to cure a photocurable polymer resin to fabricate substrates.

13. The system as recited in claim 1 wherein the three-dimensional printer comprises an additive thermoplastic-based 3D printing machine and wherein the filament or said filament mesh comprises at least one of, a conductive plane, a mechanical reinforcement and an electromagnetic shield.

14. The system as recited in claim 1 further comprising a second machine configured to create a geometrical allowance within the top surface of the layer, wherein the geometrical allowance reduces a volume of the thermoplastic substrate material to be displaced in the flowable state and increases a surface area in contact with the portion of the filament prior to embedding the filament.

Assignees

• Univ Texas

Inventors

• Wicker Ryan B
• Medina Francisco
• Macdonald Eric
• Muse Danny W
• Espalin David

Classifications

• B29C64/321

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• H05K1/0284

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• H05K2201/0129

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