Liquid cooling of multiple components on a circuit board

Patent metadata

Field	Value
Publication number	US-9342118-B2
Application number	US-201314078900-A
Country	US
Kind code	B2
Filing date	Nov 13, 2013
Priority date	Nov 12, 2013
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

First claim

What is claimed is:

1. A method, comprising:
securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased in a direction away from the secondary cold plate while limiting the travel distance between the primary cold plate and the secondary cold plate, wherein the primary cold plate is biased with two or more spring biased retainers that define an axial direction and guide the primary cold plate to move in the axial direction;
aligning the secondary cold plate with a circuit board having a plurality of heat-generating components, wherein the primary cold plate is aligned with a processor on the circuit board;
securing a plurality of spacers between the circuit board and the secondary cold plate to secure the secondary cold plate to the circuit board with a first surface of the secondary cold plate positioned a predetermined spaced distance from the circuit board, wherein the secondary cold plate has a first surface in thermal engagement with the plurality of heat-generating components on the circuit board, and wherein the primary cold plate is pressed against the processor to overcome the bias on the primary cold plate, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary cold plate and the secondary cold plate, wherein the primary cold plate and the secondary cold plate have parallel surfaces that compress the thermal interface material in response to the primary cold plate moving toward the secondary cold plate, wherein the parallel surfaces are angled between 30 and 60 degrees relative to the axial direction; and
passing a cooling liquid through a liquid cooling channel within the primary cold plate, wherein the primary cold plate draws heat from the processor and from the secondary cold plate.

2. The method of claim 1 , wherein the two or more spring biased retainers include a pre-loaded spring.

3. The method of claim 1 , wherein the plurality of spacers are a feature of the secondary cold plate and extend from the first surface of the secondary cold plate.

4. The method of claim 1 , wherein the first surface of the secondary cold plate is divided into a plurality of regions, wherein each region is aligned with one or more of the plurality of heat-generating components and has a predetermined spaced distance from the circuit board for thermal engagement with the one or more heat-generating components aligned with each region, wherein the predetermined spaced distance of each region is proportional to a height of the one or more components aligned with each region.

5. The method of claim 4 , further comprising:
securing compressible thermal interface material to the first surface in alignment with the plurality of heat-generating components, wherein the thermal interface material has a thickness that extends from the first surface within each region into thermal engagement with the one or more components aligned with each region.

6. The method of claim 5 , further comprising:
selecting, for each region, a compressible thermal interface material having a thickness that is greater than variations in the height of the one or more components aligned with each region.

7. The method of claim 3 , wherein the primary cold plate is biased by two or more spring biased retainers that define an axial direction and guide the primary cold plate to move in the axial direction, wherein the two or more spring biased retainers limit the travel of the cold plate between first and second spaced distances from the circuit board, and wherein the processor has an installed height relative to the circuit board that is intermediate of the first and second spaced distances from the circuit board.

8. The method of claim 1 , further comprising:
applying thermal grease on the primary cold plate for thermal engagement between the primary cold plate and the processor on the circuit board.

Assignees

• IBM

Inventors

• Barina Richard M
• Schmidt Derek I
• Steinke Mark E
• Womble James S

Classifications

• G06F1/20 Primary

  Cooling means · CPC title