Mounting assembly with a heatsink

Patent metadata

Field	Value
Publication number	US-10681801-B2
Application number	US-201716341997-A
Country	US
Kind code	B2
Filing date	Oct 12, 2017
Priority date	Oct 14, 2016
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A mounting assembly includes an electronic component mounted on an upper surface of a circuit board and having at least one electrical connector and a thermal pad provided on a lower surface of the component. The circuit board is mounted on a heatsink and provided with an opening beneath the thermal pad of the component. The heatsink has a heatsink extension which extends through the circuit board and is spatially separated therefrom. A thermal interface material is provided to ensure an electrically insulating thermal connection between the thermal pad and the heatsink extension.

First claim

The invention claimed is:

1. A mounting assembly, comprising:
a circuit board having an upper surface, a contact pad and an opening;
an electronic component mounted on said upper surface of said circuit board, said electronic component having a lower surface, a thermal pad provided on said lower surface of said component above said opening of said circuit board, and at least one electrical connector electrically connected to said contact pad of said circuit board;
a heatsink on which said circuit board is mounted, said heatsink having a heatsink extension extending through and spatially separated from said circuit board; and
a thermal interface material ensuring an electrically insulating thermal connection between said thermal pad and said heatsink extension.

2. The mounting assembly according to claim 1 , wherein said thermal interface material adjoins said thermal pad and said heatsink extension.

3. The mounting assembly according to claim 1 , wherein said heatsink extension has a truncated cone shape or a truncated pyramid shape.

4. The mounting assembly according to claim 1 , wherein said heatsink extension has an upper surface, and said thermal interface material is disposed between said upper surface of said heat sink extension and said thermal pad.

5. The mounting assembly according to claim 4 , wherein said heat sink extension has lateral faces, and said thermal interface material is also disposed between said lateral faces of said heat sink extension and said opening in said circuit board.

6. The mounting assembly according to claim 5 , wherein said circuit board has a lower surface, and said thermal interface material is further disposed between said heat sink and said lower surface of said circuit board.

7. The mounting assembly according to claim 1 , wherein said at least one electrical connector is soldered to said contact pad.

8. The mounting assembly according to claim 1 , wherein said thermal pad is above and completely outside of said opening of said circuit board.

9. A mounting assembly, comprising:
a circuit board having an upper surface, a contact pad and an opening;
an electronic component mounted on said upper surface of said circuit board, said electronic component having a lower surface, a thermal pad provided on said lower surface of said component above said opening of said circuit board, and at least one electrical connector electrically connected to said contact pad of said circuit board;
a heatsink on which said circuit board is mounted, said heatsink having a heatsink extension extending through and spatially separated from said circuit board;
a thermal interface material ensuring an electrically insulating thermal connection between said thermal pad and said heatsink extension; and
said circuit board including a land for said thermal pad, said land extending laterally around said opening.

10. The mounting assembly according to claim 9 , wherein said thermal pad is soldered to said land for said thermal pad.

11. A mounting assembly, comprising:
a circuit board having an upper surface, a contact pad and an opening;
an electronic component mounted on said upper surface of said circuit board, said electronic component having a lower surface, a thermal pad provided on said lower surface of said component above said opening of said circuit board, and at least one electrical connector electrically connected to said contact pad of said circuit board;
a heatsink on which said circuit board is mounted, said heatsink having a heatsink extension extending through and spatially separated from said circuit board;
a thermal interface material ensuring an electrically insulating thermal connection between said thermal pad and said heatsink extension; and
said electronic component having a casing, said circuit board being formed of a material, and a plurality of thermal vias extend through said circuit board material and are thermally coupled to said casing and to said heatsink.

Assignees

• Cpt Group Gmbh

Inventors

• Kotlar Aurelian

Classifications

• H05K2201/09054

  Raised area or protrusion of metal substrate · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K7/205 Primary

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title