Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Patent metadata

Field	Value
Publication number	US-9743558-B2
Application number	US-201514861892-A
Country	US
Kind code	B2
Filing date	Sep 22, 2015
Priority date	Oct 14, 2014
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A heat removal assembly comprising:
a vapor chamber that includes two or more surfaces to thermally couple with respective surfaces of two or more dies; and
bellows coupled to a first surface of the two or more surfaces to automatically adjust a position of the first surface to be at a different plane in relation to a second surface of the two or more surfaces.

2. The heat removal assembly of claim 1 , wherein the bellows is to flex as pressure is increased within the vapor chamber.

3. The heat removal assembly of claim 1 , further comprising a heatsink element coupled with the vapor chamber.

4. The heat removal assembly of claim 1 , wherein the heat removal assembly includes a cold plate assembly.

5. The heat removal assembly of claim 1 , further comprising a spring assembly coupled with the bellows, the spring assembly to adjust the position of at least one surface.

6. The heat removal assembly of claim 5 , wherein the spring assembly includes a coil spring or a leaf spring.

7. The heat removal assembly of claim 5 , further comprising a wicking material between the bellows and the spring assembly.

8. A multi-chip package assembly that includes a first die and a second die mounted on a package substrate, wherein the first die has a height that is greater or less than a height of the second die relative to a surface of the package substrate; and
a heat removal assembly coupled with the first die and the second die, the heat removal assembly comprising:
a vapor chamber that includes a first surface and a second surface to thermally couple with respective surfaces of the first die and the second die; and
bellows coupled to the first surface to automatically adjust a position of the first surface to be at a different plane in relation to the second surface based on the height of the first die or the second die.

9. The multi-chip package assembly of claim 8 , wherein the bellows is to flex as pressure is increased within the vapor chamber.

10. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a heatsink element coupled with the vapor chamber.

11. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a cold plate assembly.

12. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a spring assembly coupled with the bellows, the spring assembly to adjust the position of the first surface or the second surface.

13. The multi-chip package assembly of claim 12 , wherein the spring assembly includes a coil spring or a leaf spring.

14. The multi-chip package assembly of claim 12 , further comprising a wicking material between the bellows and the spring assembly.

15. A system comprising:
a circuit board;
a plurality of dies coupled with the circuit board; and
a heat removal assembly coupled with a first die and a second die of the plurality of dies, the heat removal assembly comprising:
a vapor chamber that includes a first surface and a second surface to thermally couple with respective surfaces of two of the plurality of dies; and
bellows coupled to the first surface to automatically adjust a position of the first surface to be at a different plane in relation to the second surface based on a height of the first die relative to a height of the second die measured from the circuit board.

16. The system of claim 15 , wherein the bellows is to flex as pressure is increased within the vapor chamber.

17. The system of claim 15 , wherein the heat removal assembly further includes a heatsink element coupled with the vapor chamber.

18. The system of claim 15 , wherein the heat removal assembly further includes a cold plate assembly.

19. The system of claim 15 , wherein the heat removal assembly further includes a spring assembly coupled with the bellows, the spring assembly to adjust the position of the first surface or the second surface.

20. The system of claim 19 , wherein the spring assembly includes a coil spring or a leaf spring.

21. The system of claim 19 , further comprising a wicking material between the bellows and the spring assembly.

Assignees

• Intel Corp

Inventors

• Bosak Henry C
• Boyd Thomas A
• Kofstad Harvey R

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/60 Primary

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title