Aging compensation of a ferroelectric piezoelectric shock sensor
US-12566191-B2 · Mar 3, 2026 · US
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Cook Benjamin Stassen patents
Cook Benjamin Stassen is listed as an inventor on 316 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cook Benjamin Stassen |
| Total patents | 316 |
| First publication | Mar 31, 2016 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Bi-Layer Nanoparticle Adhesion Film
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Thermal management in integrated circuit using phononic bandgap structure
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Semicondctor device package thermal conduit
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3D printed semiconductor package
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Sensor packages with wavelength-specific light filters
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Sensor packages with wavelength-specific light filters
US-12317638-B2 · May 27, 2025 · US
Acoustic waveguide with diffraction grating
US-2025096449-A1 · Mar 20, 2025 · US
Differential measurement of ir absorption in plasmonic mems sensors
US-2025076190-A1 · Mar 6, 2025 · US
Through wafer trench isolation between transistors in an integrated circuit
US-2025079340-A1 · Mar 6, 2025 · US
Recent patents
Latest publications not already listed above.
Filler particles for polymers
US-2025066526-A1 · Feb 27, 2025 · US
Acoustic waveguide with diffraction grating
US-12191554-B2 · Jan 7, 2025 · US
Additive process for circular printing
US-12172374-B2 · Dec 24, 2024 · US
Floating die package
US-12176298-B2 · Dec 24, 2024 · US
Custom leadframe from standard plus printed leadframe portion
US-2024413058-A1 · Dec 12, 2024 · US
Through wafer trench isolation between transistors in an integrated circuit
US-12148717-B2 · Nov 19, 2024 · US
Filler particles for polymers
US-12139569-B2 · Nov 12, 2024 · US
Thermal routing trench by additive processing
US-2024312862-A1 · Sep 19, 2024 · US
Custom leadframe from standard plus printed leadframe portion
US-12080633-B2 · Sep 3, 2024 · US
SP2-Bonded Carbon Structures
US-2024246317-A1 · Jul 25, 2024 · US
Methods and apparatus for surface wetting control
US-12042829-B2 · Jul 23, 2024 · US
Liquid metal MEMS switch
US-12046430-B2 · Jul 23, 2024 · US
Process for thin film capacitor integration
US-2024194574-A1 · Jun 13, 2024 · US
Thermal routing trench by additive processing
US-11996343-B2 · May 28, 2024 · US
Thermally conductive wafer layer
US-2024153841-A1 · May 9, 2024 · US
3d printed semiconductor package
US-2024145526-A1 · May 2, 2024 · US
Additive process for circular printing
US-2024109247-A1 · Apr 4, 2024 · US
Process for thin film capacitor integration
US-11948871-B2 · Apr 2, 2024 · US
SP2-bonded carbon structures
US-11938715-B2 · Mar 26, 2024 · US
Aging compensation of a ferroelectric piezoelectric shock sensor
US-2024077514-A1 · Mar 7, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 316 |
| Texas Instruments Deutschland | 3 |
| Texas Instuments Incorporated | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/756 | 122 |
| H10W72/884 | 99 |
| H10W90/736 | 88 |
| H10W74/00 | 64 |
| H10W74/111 | 59 |