Integration of backside heat spreader for thermal management

Patent metadata

Field	Value
Publication number	US-9698075-B2
Application number	US-201615210970-A
Country	US
Kind code	B2
Filing date	Jul 15, 2016
Priority date	Sep 28, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.

First claim

What is claimed is:

1. A microelectronic device, comprising:
a semiconductor device having a front surface and a back surface;
a component at the front surface;
a backside heat spreader layer at the back surface, the backside heat spreader layer comprising a heat spreader material 100 nanometers to 3 microns thick, having an in-plane thermal conductivity of at least 150 watts/meter-° K and an electrical resistivity of less than 100 micro-ohm-centimeters; and
a cap layer directly contacting and completely covering a surface of the backside heat spreader layer opposite the semiconductor device and sidewalls of the backside heat spreader layer.

2. The microelectronic device of claim 1 , wherein the heat spreader material comprises graphite.

3. The microelectronic device of claim 1 , wherein the heat spreader material comprises carbon nanotubes (CNTs).

4. The microelectronic device of claim 1 , wherein the backside heat spreader layer is patterned.

5. The microelectronic device of claim 1 , wherein the backside heat spreader layer comprises an adhesion layer between the heat spreader material and the back surface.

6. The microelectronic device of claim 1 , wherein the cap layer comprises titanium and titanium nitride.

7. The microelectronic device of claim 1 , wherein the microelectronic device further comprises a substrate, wherein the semiconductor device is attached to the substrate by a die attach material contacting the substrate and the backside heat spreader layer.

8. The microelectronic device of claim 1 , wherein the microelectronic device further comprises a substrate, wherein the semiconductor device is attached to the substrate by bump bonds at the front surface, the bump bonds contacting the substrate, and the backside heat spreader layer is attached to a heat sink.

9. A microelectronic device, comprising:
a semiconductor device having a first surface and a second surface opposite the first surface;
a component at the first surface;
a backside heat spreader layer at the second surface, the backside heat spreader layer comprising:
a heat spreader material selected from the group consisting of graphite, carbon nanotubes, multiple layers of graphene, boron nitride, or a combination thereof;
an adhesion layer comprising titanium between the heat spreader material and the second surface; and
a cap layer comprising titanium directly contacting and completely covering a surface of the heat spreader material opposite the semiconductor device and sidewalls of the heat spreader material.

10. The microelectronic device of claim 9 , wherein the adhesion layer comprises titanium tungsten.

11. The microelectronic device of claim 9 , wherein the cap layer comprises titanium nitride.

12. The microelectronic device of claim 9 , wherein the backside heat spreader layer consists of multiple islands of said heat spreader material, each separated from the second surface by said adhesion layer.

13. The microelectronic device of claim 9 , wherein the microelectronic device further comprises a substrate, wherein the semiconductor device is attached to the substrate by a die attach material contacting the substrate and the backside heat spreader layer.

14. The microelectronic device of claim 9 , wherein the microelectronic device further comprises a substrate, wherein the semiconductor device is attached to the substrate by bump bonds at the front surface, the bump bonds contacting the substrate, and the backside heat spreader layer is attached to a heat sink.

Assignees

• Texas Instruments Inc

Inventors

• Venugopal Archana
• Denison Marie
• Colombo Luigi
• Nguyen Hiep
• Edwards Darvin

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title