Semiconductor package
US-2024297150-A1 · Sep 5, 2024 · US
Cross-sectional shape, i.e. in side view
Cross-sectional shape, i.e. in side view · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/334 |
| Official title | {Cross-sectional shape, i.e. in side view} |
| Display label | Cross-sectional shape, i.e. in side view |
| Total patents | 1,369 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 70 |
| 2016 | 71 |
| 2017 | 88 |
| 2018 | 78 |
| 2019 | 92 |
| 2020 | 147 |
| 2021 | 151 |
| 2022 | 163 |
| 2023 | 161 |
| 2024 | 155 |
| 2025 | 160 |
| 2026 | 33 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium
US-2015371930-A1 · Dec 24, 2015 · US
Semiconductor device and semiconductor device manufacturing method
US-2015371966-A1 · Dec 24, 2015 · US
Method of manufacturing optical module
US-9214446-B2 · Dec 15, 2015 · US
Eutectic solder structure for chip
US-9214443-B2 · Dec 15, 2015 · US
Package systems
US-2015340341-A1 · Nov 26, 2015 · US
Semiconductor package with single sided substrate design and manufacturing methods thereof
US-9196597-B2 · Nov 24, 2015 · US
Semiconductor device and manufacturing method of the same
US-9190354-B2 · Nov 17, 2015 · US
Preform including a groove extending to an edge of the preform
US-9190384-B2 · Nov 17, 2015 · US
Light emitting diode display with redundancy scheme
US-2015318328-A1 · Nov 5, 2015 · US
Connection arrangement of an electric and/or electronic component
US-9177934-B2 · Nov 3, 2015 · US
Semiconductor device and lead frame used for the same
US-9177900-B2 · Nov 3, 2015 · US
Method of manufacturing semiconductor device including thermal compression
US-9171820-B2 · Oct 27, 2015 · US
Semiconductor package
US-9171819-B2 · Oct 27, 2015 · US
Thermal interface compositions and methods for making and using same
US-2015303129-A1 · Oct 22, 2015 · US
Method for ternary wafer bonding and structure thereof
US-2015294950-A1 · Oct 15, 2015 · US
Semiconductor die package and method for making the same
US-9159656-B2 · Oct 13, 2015 · US
Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
US-9159652-B2 · Oct 13, 2015 · US
SUBSTRATE (As Amended)
US-2015289371-A1 · Oct 8, 2015 · US
Chip package and method for forming the same
US-2015279808-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/334?
- CPC H10W72/334 is the Cooperative Patent Classification code for “Cross-sectional shape, i.e. in side view.”
- How many patents are filed under CPC H10W72/334 (Cross-sectional shape, i.e. in side view)?
- Our database includes 1,369 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/334 growing?
- Publication counts under this code: 155 in 2024 vs 160 in 2025 (latest complete years).