Micro-component transfer systems, methods, and devices

Patent metadata

Field	Value
Publication number	US-11246251-B2
Application number	US-201916402054-A
Country	US
Kind code	B2
Filing date	May 2, 2019
Priority date	May 2, 2019
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

First claim

We claim:

1. A system comprising:
a computing device including circuitry and memory with instructions for execution by the circuitry to:
monitor signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and
in response to the monitored signals, actuate multiple actuators to extend a distance towards the transfer head or the receiving substrate to deform and shape the transfer head or the receiving substrate.

2. The system of claim 1 , further comprising:
a base assembly including the multiple actuators secured thereon.

3. The system of claim 2 , wherein the multiple actuators are mechanical actuators.

4. The system of claim 2 , wherein the multiple actuators are piezo-electric-based, voice-coil-motor-based, or magnetorestriction-based actuators.

5. The system of claim 2 , further comprising:
the receiving substrate, wherein the multiple actuators are arranged to be removably coupled to the receiving substrate to deform the receiving substrate.

6. The system of claim 1 , wherein the monitored signals include signals indicative of light emitted from electrical components being transferred to the receiving substrate.

7. The system of claim 6 , further comprising:
an optical detector arranged to generate the monitored signals.

8. The system of claim 1 , wherein the monitored signals include signals generated by capacitance sensors positioned on the transfer head and the receiving substrate.

9. The system of claim 1 , wherein the transfer head includes a first set of conductive grids, wherein the receiving substrate includes a second set of conductive grids.

10. The system of claim 1 , wherein either the transfer head or the receiving substrate includes a pair of serpentine-shaped conductive grids.

11. The system of claim 1 , wherein the monitored signals include signals generated by electrical components being transferred to the receiving substrate.

12. The system of claim 11 , further comprising:
conductive pillars positioned between the transfer head and the receiving substrate and arranged to generate the monitored signals.

13. A method for transferring electrical components from a transfer head to a receiving substrate, the method comprising:
monitoring signals indicative of a non-uniform distance between the transfer head and the receiving substrate; and
shaping the transfer head or the receiving substrate by actuating multiple actuators to extend towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate based, at least in part, on the monitored signals.

14. The method of claim 13 , wherein the monitored signals include signals indicative of light emitted from the electrical components being transferred to the receiving substrate.

15. The method of claim 14 , wherein the multiple one or more actuators is actuated towards the transfer head or the receiving substrate until a minimum percentage or number of electrical components emit light.

16. The method of claim 13 , wherein the monitored signals include signals generated by capacitance sensors positioned on the transfer head and/or the receiving substrate.

17. The method of claim 13 , wherein the monitored signals include signals generated by the electrical components being transferred to the receiving substrate.

18. The method of claim 13 , further comprising:
deforming the transfer head or the receiving substrate, via the multiple actuators, until the transfer head or the receiving substrate are a substantially-uniform distance from each other.

19. The method of claim 13 , further comprising:
deforming the transfer head or the receiving substrate, via the multiple actuators, until a minimum percentage or number electrical components are electrically coupled to bond pads positioned on the receiving substrate.

20. The method of claim 13 , wherein the multiple actuators directly contact the transfer head or the receiving substrate to cause the shaping.

Assignees

• Seagate Technology Llc

Inventors

• Conover Michael J
• Guzman Javier I
• Tsu I-Fei
• Schobel Joseph J

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H05K13/0406

  Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping · CPC title

• H05K13/0812

  the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement · CPC title

• B25J7/00

  Micromanipulators {(specimen supports for investigating or analysing materials G01N23/2204; associated with microscopes G02B21/32; means for supporting or positioning the objects or the material in discharge tubes H01J37/20)} · CPC title

• H05K13/0815 Primary

  Controlling of component placement on the substrate during or after manufacturing · CPC title