Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device

Patent metadata

Field	Value
Publication number	US-9842782-B2
Application number	US-201615080607-A
Country	US
Kind code	B2
Filing date	Mar 25, 2016
Priority date	Mar 25, 2016
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

First claim

What is claimed is:

1. A method for preparing a plurality of micro-devices for transfer, the method comprising:
temporarily bonding the micro-devices onto a carrier substrate;
testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices;
removing the first failed micro-device from the carrier substrate;
transferring remaining micro-devices from the carrier substrate to a receiving substrate after the removing;
acquiring at least one location of at least one micro-device void on the receiving substrate; and
patching the micro-device void on the receiving substrate with at least one patching micro-device.

2. The method of claim 1 , wherein the removing comprises:
reducing a bonding force of a bonding layer used to bond the micro-devices; and
addressably removing the first failed micro-device from the carrier substrate.

3. The method of claim 1 , wherein the removing comprises:
reducing a bonding force of a bonding layer used to bond the first failed micro-device while leaving the other micro-device bonded on the carrier substrate; and
removing the first failed micro-device.

4. The method of claim 1 , wherein the transferring is performed by at least one transfer head capable of addressably picking at least one of the remaining micro-devices.

5. The method of claim 1 , wherein the transferring is performed by at least one transfer head capable of non-addressably picking the remaining micro-devices.

6. The method of claim 1 , wherein the transferring is performed by electrostatic chucking, adhesive chucking, or any combination thereof.

7. The method of claim 1 , wherein the transferring comprises:
addressably transferring at least one of the remaining micro-devices from the carrier substrate to the receiving substrate; and
addressably transferring at least another of the remaining micro-devices from the carrier substrate to the receiving substrate.

8. The method of claim 1 , further comprising:
storing at least one location of the first failed micro-device on the carrier substrate; and
determining the location of the micro-device void on the receiving substrate according to the location of the first failed micro-device on the carrier substrate.

9. The method of claim 1 , further comprising:
testing the micro-devices on the receiving substrate to determine if there is at least one pixel having a second failed micro-device on the receiving substrate; and
disposing at least one repairing micro-device onto the pixel having the second failed micro-device on the receiving substrate.

Assignees

• Mikro Mesa Tech Co Ltd

Inventors

• Chen Li-Yi
• Chang Pei-Yu
• Chan Chih-Hui
• Chang Chun-Yi
• Lin Shih-Chyn
• Lee Hsin-Wei

Classifications

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P72/0611 Primary

  Sorting devices · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title