Polishing head, and chemical-mechanical polishing system for polishing substrate

Patent metadata

Field	Value
Publication number	US-9272386-B2
Application number	US-201314058054-A
Country	US
Kind code	B2
Filing date	Oct 18, 2013
Priority date	Oct 18, 2013
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector.

First claim

What is claimed is:

1. A polishing head for a chemical-mechanical polishing system, the polishing head comprising:
a carrier head;
at least one electromagnetism actuated pressure sector disposed on the carrier head, wherein the electromagnetism actuated pressure sector comprises:
a stator being stationary with respect to the carrier head;
an active cell linearly movable with respect to the carrier head and in electromagnetic cooperation with the stator: and
a sector plate connected to the active cell; and

a membrane covering the electromagnetism actuated pressure sector.

2. The polishing head of claim 1 , wherein at least two of the electromagnetism actuated pressure sectors are located on the same circumferential line relative to a center axis of the carrier head.

3. The polishing head of claim 1 , wherein a plurality of the electromagnetism actuated pressure sectors are at least partially arranged along a circumferential line relative to a center axis of the carrier head.

4. The polishing head of claim 1 , wherein a plurality of the electromagnetism actuated pressure sectors are at least partially arranged in at least one row and at least one column.

5. The polishing head of claim 1 , wherein the stator is a permanent magnet, and the active cell is a coil assembly.

6. The polishing head of claim 1 , wherein the electromagnetism actuated pressure sector further comprises:
an elastic element connecting the sector plate to the carrier head.

7. The polishing head of claim 1 , wherein
the stator is a coil assembly, and
the active cell is a permanent magnet.

8. The polishing head of claim 1 , further comprising:
a controller for controlling the motion of the electromagnetism actuated pressure sector by electric current.

9. The polishing head of claim 1 , further comprising:
a receiver for obtaining a pre-polished process data; and
a controller for controlling the motion of the electromagnetism actuated pressure sector according to the pre-polished process data.

10. The polishing head of claim 1 , further comprising:
a controller for in-situ controlling the motion of the electromagnetism actuated pressure sector.

11. The polishing head of claim 1 , further comprising:
a sensor for sensing a displacement of the electromagnetism actuated pressure sector; and
a calibrator for calibrating the carrier head according to the sensed displacement of the electromagnetism actuated pressure sector.

12. A chemical-mechanical polishing system comprising:
a polishing head comprising:
a carrier head having at least one opening therein;
a plurality of electromagnetism actuated pressure sectors arranged on the carrier head, wherein at least one of the electromagnetism actuated pressure sectors comprises:
a stator being stationary with respect to the opening;
an active cell telescopically received in the opening and in electromagnetic cooperation with the stator; and
a sector plate connected to the active cell; and

a membrane covering the electromagnetism actuated pressure sectors;

a platen disposed below the polishing head; and
a slurry introduction mechanism disposed above the platen.

13. The chemical-mechanical polishing system of claim 12 , wherein at least two of the electromagnetism actuated pressure sectors are located on the same circumferential line relative to a center axis of the carrier head.

14. A chemical-mechanical polishing system comprising:
a platen configured to allow a polishing pad to be disposed thereon; and
a polishing head configured to hold a substrate against the polishing pad, the polishing head comprising:
a carrier head; and
a plurality of pressure sectors disposed on the carrier head to apply localized pressures to the substrate, wherein at least two of the pressure sectors are located on a same circumferential line relative to a center axis of the carrier head, and at least one of the pressure sectors comprises:
a stator being stationary with respect to the carrier head;
an active cell telescopically received in the carrier head and in electromagnetic cooperation with the stator; and
a sector plate connected to the active cell.

15. The chemical-mechanical polishing system of claim 14 , wherein the pressure sectors are at least partially arranged substantially in a plurality of the circumferential lines and radial lines relative to the center axis of the carrier head.

16. The chemical-mechanical polishing system of claim 14 , wherein the pressure sectors are at least partially arranged substantially in rows and columns.

17. The chemical-mechanical polishing system of claim 14 , wherein at least one of the pressure sectors is electromagnetism actuated.

18. The chemical-mechanical polishing system of claim 14 , further comprising:
a membrane covering the pressure sectors.

19. The chemical-mechanical polishing system of claim 14 , further comprising:
a controller configured to individually control the movements of the pressure sectors.

20. The chemical-mechanical polishing system of claim 14 , wherein the pressure sectors further comprise:
an elastic element connecting the sector plate to the carrier head.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Suen Shich-Chang
• Chan Chin-Hsiang
• Chen Liang-Guang
• Lu Yung-Cheng

Classifications

• B24B37/20 Primary

  Lapping pads for working plane surfaces · CPC title

• B24D9/08

  Circular back-plates for carrying flexible material · CPC title

• B24B41/06

  Work supports, e.g. adjustable steadies (B24B37/27 takes precedence) · CPC title

• B24B37/30 Primary

  for single side lapping of plane surfaces · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title