Flexible display and method of formation with sacrificial release layer

Patent metadata

Field	Value
Publication number	US-9318475-B2
Application number	US-201414278778-A
Country	US
Kind code	B2
Filing date	May 15, 2014
Priority date	May 15, 2014
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.

First claim

What is claimed is:

1. A flexible display panel, comprising:
a flexible substrate comprising a front surface, a back surface, and a display area on the front surface;
a plurality of interconnects that extend at least partially through the flexible substrate from the front surface to the back surface, wherein the flexible substrate and the plurality of interconnects form a build-up structure;
an array of light emitting diodes (LEDs) and a plurality of microchips on the front surface of the flexible substrate in the display area and electrically coupled to the plurality of interconnects, wherein the plurality of microchips are interspersed within the array of LEDs, and each microchip comprises a driving circuit to drive one or more LEDs within the array of LEDs to emit light; and
a plurality of release openings extending through the flexible substrate from the front surface to the back surface.

2. The flexible display panel of claim 1 , further comprising:
at least one display component electrically coupled to the array of microchips on the front surface of the flexible substrate through the plurality of interconnects, wherein the display component comprises a chip selected from the group consisting of a sense controller chip, a scan driver chip, a data driver chip, a processor chip, and a power supply.

3. The flexible display panel of claim 2 , wherein the display component is on the back surface of the flexible substrate.

4. The flexible display panel of claim 2 , wherein the display component is on the front surface of the flexible substrate outside of the display area.

5. The flexible display panel of claim 1 , wherein the build-up structure comprises at least one layer of polymer and at least one layer of metal.

6. The flexible display panel of claim 1 , wherein the array of LEDs is arranged in a matrix including a plurality of rows and a plurality of columns of the LEDs.

7. The flexible display panel of claim 6 , wherein the plurality of microchips comprises a row of microchips arranged between two rows of the LEDs.

8. The flexible display panel of claim 6 , wherein each driving circuit is to drive a plurality of the LEDs within the array of LEDs.

9. The flexible display panel of claim 8 , further comprising at least one display component electrically coupled to the array of microchips on the front surface of the flexible substrate through the plurality of interconnects.

10. The flexible display panel of claim 9 , wherein display component comprises a chip selected from the group consisting of a sense controller chip, a scan driver chip, a data driver chip, a processor chip, and a power supply.

11. The flexible display panel of claim 9 , wherein the display component is on the back surface of the flexible substrate directly behind the display area.

12. The flexible display panel of claim 8 , wherein the plurality of interconnects comprises a plurality of conductive layers coupled to each other.

13. The flexible display panel of claim 1 , wherein the array of LEDs is arranged in a matrix including a plurality of rows of the LEDs, and plurality of microchips is arranged in a plurality of rows of the microchips arranged between rows of the LEDs.

14. The flexible display panel of claim 13 , wherein each LED has a maximum width of 1 to 20 μm.

15. The flexible display panel of claim 13 , wherein further comprising a patterned insulating layer including an array of wells, and the array of LEDs is bonded to a conductive layer in the array of wells.

16. The flexible display panel of claim 15 , further comprising a sidewall passivation layer laterally around the array of LEDs within the array of wells.

17. The flexible display panel of claim 13 , wherein the plurality of release openings are within the display area.

18. The flexible display panel of claim 17 , wherein the plurality of release openings are interspersed within the array of LEDs.

Assignees

• Luxvue Technology Corp

Inventors

• Bibl Andreas
• Golda Dariusz

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/874

  On different surfaces · CPC title