Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit

Patent metadata

Field	Value
Publication number	US-11244892-B2
Application number	US-201916550775-A
Country	US
Kind code	B2
Filing date	Aug 26, 2019
Priority date	Aug 30, 2018
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.

First claim

The invention claimed is:

1. A printed circuit board, comprising:
a thermal pad; and
a solder mask that leaves portions of the thermal pad unmasked leaving exposed a plurality of unmasked portions of the thermal pad from the solder mask, each one of the plurality of unmasked portions of the thermal pad each including a plurality of edges, and the solder mask including a plurality of mask stripes extending from the plurality of edges of the plurality of unmasked portions, each one of the plurality of mask stripes extends towards a corresponding center of one of the unmasked portions.

2. The printed circuit board of claim 1 , wherein the plurality of mask stripes include orthogonal mask stripes extending from the edges of each unmasked portion towards the corresponding center of one of the unmasked portions.

3. The printed circuit board of claim 1 , wherein each unmasked portion includes a plurality of corners, and wherein the plurality of mask stripes include angled corner mask stripes extending from the corners towards the corresponding center of one of the unmasked portions.

4. The printed circuit board of claim 1 , wherein each of the unmasked portions includes a plurality of corners, and wherein the plurality of mask stripes include corner mask stripes in each corner of each one of the unmasked portions.

5. A device, comprising:
a thermal pad includes a surface;
a solder mask on the surface of the thermal pad, the solder mask including:
a first portion extending in a first direction;
a second portion extending in a second direction transverse to the first direction, the first portion and the second portion extend across each other;
a third portion surrounding the first portion and the second portion; and
a first extension portion extends from the third portion toward the second portion of the solder mask;

an exposed portion of the thermal pad exposed from the solder mask, the exposed portion of the thermal pad surrounded by the first, second, and third portions of the solder mask, and
wherein the first extension portion extends into the exposed portion of the thermal pad.

6. The device of claim 5 , wherein the exposed portion is a square region.

7. The device of claim 6 , wherein the solder mask further includes a second extension portion that extends from the third portion of the solder mask towards the first portion of the solder mask, the second extension portion extends into the square region.

8. The device of claim 7 , wherein the first extension portion has an end that terminates between the first, second, and third portions of the solder mask.

9. The device of claim 5 , wherein the first extension portion of the solder mask has an end that terminates before the first extension portion extends to the second portion of the solder mask.

10. The device of claim 9 , wherein the end of the first extension portion is between the first, second, and third portions of the solder mask.

11. The device of claim 5 , wherein the solder mask further includes a second extension portion that extends from the third portion, the extension portion being at a first angle to the first portion of the solder mask and at a second angle to the second portion of the solder mask.

12. The device of claim 11 , wherein the first angle is substantially equal to the second angle.

13. The device of claim 12 , wherein the exposed portion is a square region having a corner, and the second extension portion extends into the corner of the square region.

14. The device of claim 11 , wherein the first angle is greater than the second angle.

15. The device of claim 11 , wherein the first angle is less than the second angle.

16. The device of claim 5 , wherein the solder mask further includes a second extension portion that extends between respective adjacent portions of the third portion.

17. A device, comprising:
a thermal pad having a surface;
a solder mask on the surface of the thermal pad, the solder mask including:
a first cross-over portion extending in a first direction;
a second cross-over portion extending in a second direction, the second cross-over portion crossing over the first cross-over portion; and
a boundary portion that surrounds the first cross-over portion and the second cross-over portion, the first cross-over portion having first ends that terminate at the boundary portion, the second cross-over portion having second ends that terminate at the boundary portion;

an exposed portion of the thermal pad exposed from the solder mask, the exposed portion of the thermal pad surrounded by the solder mask;
a first plurality of vias are aligned with the boundary portion;
a second plurality of vias are aligned with the first cross-over portion; and
a third plurality of vias are aligned with the second cross-over portion.

18. The device of claim 17 , wherein the solder mask further includes a plurality of mask strip portions that extend outward from the first cross-over portion, the second cross-over portion, and the boundary portion towards the exposed portion of the thermal pad.

19. The device of claim 18 , wherein the plurality of mask strip portions further includes:
a first mask strip portion parallel with the first cross-over portion;
a second mask strip portion parallel with the second cross-over portion;
a third mask strip portion at a first angle to the first cross-over portion and a second angle to the second cross-over portion;
a fourth mask strip portion that extends between respective adjacent portions of the boundary portion.

Assignees

• St Microelectronics Pte Ltd

Inventors

• Yap Daniel
• Loh Hung Meng

Classifications

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/461

  specially adapted for cooling · CPC title

• H10W70/417

  Bonding materials between chips and die pads · CPC title

• H10W70/098

  Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title