Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-12322692-B2 · Jun 3, 2025 · US
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Yap Daniel patents
Yap Daniel is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yap Daniel |
| Total patents | 4 |
| First publication | Mar 5, 2020 |
| Latest publication | Jun 3, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-2022130750-A1 · Apr 28, 2022 · US
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-11244892-B2 · Feb 8, 2022 · US
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-2020075475-A1 · Mar 5, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Pte Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/129 | 4 |
| H10W70/465 | 4 |
| H10W70/461 | 4 |
| H10W70/417 | 4 |
| H10W70/098 | 4 |