Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-12322692-B2 · Jun 3, 2025 · US
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Patent family 69641663
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 69641663 |
| Family type | — |
| Earliest priority | Aug 30, 2018 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12322692B2 — Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit |
Representative publication
Best representative member for this family based on priority and filing country.
US12322692B2 — Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit (published Jun 3, 2025)
Member publications
Related publications in this family.
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-2022130750-A1 · Apr 28, 2022 · US
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-11244892-B2 · Feb 8, 2022 · US
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
US-2020075475-A1 · Mar 5, 2020 · US