Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Bonding materials between chips and die pads
Bonding materials between chips and die pads · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/417 |
| Official title | {Bonding materials between chips and die pads} |
| Display label | Bonding materials between chips and die pads |
| Total patents | 2,153 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 146 |
| 2016 | 165 |
| 2017 | 180 |
| 2018 | 170 |
| 2019 | 205 |
| 2020 | 193 |
| 2021 | 213 |
| 2022 | 182 |
| 2023 | 249 |
| 2024 | 210 |
| 2025 | 186 |
| 2026 | 54 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
Semiconductor device
US-2024282677-A1 · Aug 22, 2024 · US
Semiconductor device and method for manufacturing semiconductor device
US-2024030159-A1 · Jan 25, 2024 · US
Method of manufacturing semiconductor device and semiconductor device
US-2024006275-A1 · Jan 4, 2024 · US
Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium
US-2015371930-A1 · Dec 24, 2015 · US
Power semiconductor device and preparation method thereof
US-9214419-B2 · Dec 15, 2015 · US
Semiconductor device
US-2015357289-A1 · Dec 10, 2015 · US
Combined packaged power semiconductor device
US-2015357267-A1 · Dec 10, 2015 · US
Discontinuous patterned bonds for semiconductor devices and associated systems and methods
US-2015357314-A1 · Dec 10, 2015 · US
Bandwidth limiting methods for gan power transistors
US-2015349727-A1 · Dec 3, 2015 · US
Integrated circuit package with die attach paddle having at least one recessed portion
US-9202778-B2 · Dec 1, 2015 · US
Electronic device including components in component receiving cavity and related methods
US-2015332995-A1 · Nov 19, 2015 · US
Semiconductor device with step portion having shear surfaces
US-2015325502-A1 · Nov 12, 2015 · US
Adhesive composition, adhesive sheet and production process for semiconductor device
US-9184082-B2 · Nov 10, 2015 · US
Semiconductor device and method of manufacturing the same
US-9177833-B2 · Nov 3, 2015 · US
High efficiency module
US-2015303136-A1 · Oct 22, 2015 · US
Semiconductor device and electronic device
US-2015303217-A1 · Oct 22, 2015 · US
Cavity-down pressure sensor device
US-2015285702-A1 · Oct 8, 2015 · US
Method of manufacturing semiconductor device
US-9153527-B2 · Oct 6, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/417?
- CPC H10W70/417 is the Cooperative Patent Classification code for “Bonding materials between chips and die pads.”
- How many patents are filed under CPC H10W70/417 (Bonding materials between chips and die pads)?
- Our database includes 2,153 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/417 growing?
- Publication counts under this code: 210 in 2024 vs 186 in 2025 (latest complete years).