Stacked modules

Patent metadata

Field	Value
Publication number	US-11239170-B2
Application number	US-201616305008-A
Country	US
Kind code	B2
Filing date	Dec 2, 2016
Priority date	Jun 14, 2016
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

First claim

The invention claimed is:

1. A module comprising:
a lower component of the module having a first material in which at least a first structural element is embedded, and
an upper component of the module having a second material in which at least a second structural element is embedded,
wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter,
wherein the upper component of the module and the lower component of the module are stacked on top of one another,
wherein the lower and the upper components of the module are in electrical connection and are mechanically connected,
wherein at least one of the lower and upper components of the module, on a side facing the other of the lower and upper component of the module, has a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together; and
wherein the upper component of the module has a second rewiring layer on its upper side directed away from the lower component of the module and has a metallization that forms both an antenna structure as well as passive elements that are connected with the second structural element.

2. The module of claim 1 , wherein at least one of the components of the module, on its under side and on its opposite upper side has a rewiring layer, wherein the rewiring layers are connected with a plated through hole that extends through the component of the module.

3. The module of claim 1 ,
wherein the lower component of the module has metal columns on an upper side facing the upper component of the module,
wherein the upper component of the module has metal columns on its under side facing the lower component of the module, and
wherein the metal columns of the lower component of the module and the metal columns of the upper component of the module are connected.

4. The module of claim 1 , wherein the first or second material is a prepreg material or a molding material.

5. A module comprising:
a lower component of the module having a first material in which at least a first structural element is embedded, and
an upper component of the module having a second material in which at least a second structural element is embedded,
a metallization arranged on an exterior surface of the module which allows an electromagnetic shielding of the module or which is used to dissipate heat from the module,
wherein the upper component of the module and the lower component of the module are stacked on top of one another,
wherein the lower and the upper components of the module are in electrical connection and are mechanically connected, and

wherein at least one of the components of the module, on a side facing the other component of the module, has a rewiring layer having a metal coating, by means of which the module components are electrically connected together.

6. The module of claim 5 , wherein:
the metallization that forms an antenna structure arranged on an exterior surface of the module.

7. The module of claim 5 , wherein the first and/or the second structural element is selected from a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, or a microelectromechanical systems (MEMS) device.

8. A module comprising:
a lower component of the module having a first material in which at least a first structural element is embedded, and
an upper component of the module having a second material in which at least a second structural element is embedded, the upper component being electrically and mechanically connected to the lower component,
wherein the upper component has a rewiring layer having a metal coating that forms an antenna structure connected with the second structural element,
wherein the upper component and the lower component are stacked on top of one another, and
wherein an acoustic wave filter is the first structural element and/or the second structural element.

9. A module comprising:
a lower component having a first structural element embedded in a first material,
an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material,
wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter,
wherein at least one of the lower and upper components of the module has, on a side facing the other of the lower and upper component of the module, a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together, and a second rewiring layer on an opposite upper side, and
wherein the first and second rewiring layers are connected with a plated through hole that extends through the component of the module.

10. A module comprising:
a lower component having a first structural element embedded in a first material,
an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material,
wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter,
wherein at least one of the lower and upper components of the module, on a side facing the other of the lower and upper component of the module, has a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together; and
wherein the lower component of the module has metal columns on an upper side facing the upper component of the module,
wherein the upper component of the module has metal columns on an under side facing the lower component of the module, and
wherein the metal columns of the lower component of the module and the metal columns of the upper component of the module are connected.

Assignees

• Snaptrack Inc

Inventors

• Franz Andreas
• Portmann Jürgen
• Reitlinger Claus
• Kiefl Stefan
• Freudenberg Oliver
• Weidner Karl

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/20

  Configurations of stacked chips · CPC title