Matchless plasma source for semiconductor wafer fabrication

Patent metadata

Field	Value
Publication number	US-11224116-B2
Application number	US-202016853516-A
Country	US
Kind code	B2
Filing date	Apr 20, 2020
Priority date	Oct 18, 2017
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

A matchless plasma source is described. The matchless plasma source includes a controller that is coupled to a direct current (DC) voltage source of an agile DC rail to control a shape of an amplified square waveform that is generated at an output of a half-bridge transistor circuit. The matchless plasma source further includes the half-bridge transistor circuit used to generate the amplified square waveform to power an electrode, such as an antenna, of a plasma chamber. The matchless plasma source also includes a reactive circuit between the half-bridge transistor circuit and the electrode. The reactive circuit has a high-quality factor to negate a reactance of the electrode. There is no radio frequency (RF) match and an RF cable that couples the matchless plasma source to the electrode.

First claim

The invention claimed is:

1. A plasma source comprising:
an input section configured to generate a square wave signal; and
an output section coupled to the input section to receive the square wave signal, wherein the output section is configured to generate a plurality of pulsed signals based on the square wave signal, wherein the plurality of pulsed signals include a first pulsed signal and a second pulsed signal, wherein the first pulsed signal is in reverse synchronization with the second pulsed signal, wherein when the first pulsed signal transitions from a first low level to a first high level, the second pulsed signal transitions from a second high level to a second low level, wherein when the first pulsed signal transitions from the first high level to the first low level, the second pulsed signal transitions from the second low level to the second high level,
wherein the output section is configured to amplify the plurality of pulsed signals to output an amplified square waveform, and
wherein the input section includes an arbitrary waveform generator coupled to the output section to shape the amplified square waveform.

2. The plasma source of claim 1 , wherein the input section includes:
a controller board, wherein the controller board is configured to generate the square wave signal; and
a gate driver portion coupled to the controller board, wherein the gate driver portion is configured to receive the square wave signal.

3. The plasma source of claim 2 , wherein the square wave signal has a frequency, wherein the controller board includes a controller and a signal generator, wherein the controller is coupled to the signal generator, wherein the controller is configured to provide a signal indicating a frequency value of the frequency to the signal generator, and wherein the signal generator is configured to generate the square wave signal in response to receiving the signal indicating the frequency value.

4. The plasma source of claim 3 , wherein the frequency value is 400 kilohertz, or 2 megahertz, or 13.56 megahertz, or 27 megahertz, or 60 megahertz.

5. The plasma source of claim 2 , wherein the gate driver portion includes:
a gate driver sub-portion, wherein the gate driver sub-portion is configured to amplify the square wave signal to output an amplified signal; and
a primary winding coupled to the gate driver sub-portion for receiving the amplified signal.

6. The plasma source of claim 5 , wherein the output section includes:
another gate driver portion including:
a first secondary winding; and
a second secondary winding, wherein the first secondary winding is configured to output the first pulsed signal upon reception of the amplified signal by the primary winding, wherein the second secondary winding is configured to output the second pulsed signal upon reception of the amplified signal by the primary winding.

7. The plasma source of claim 6 , wherein the output section includes a half-bridge circuit coupled to the first secondary winding and the second secondary winding, wherein the half-bridge circuit is configured to output the amplified square waveform upon receiving the first pulsed signal and the second pulsed signal.

8. The plasma source of claim 7 , wherein the half-bridge circuit includes a direct current (DC) voltage source, a DC rail, and a plurality of transistors, wherein the DC voltage source is coupled via the DC rail to the plurality of transistors, wherein the plurality of transistors include a first transistor and a second transistor, and wherein the amplified square waveform is output between the first transistor and the second transistor.

9. The plasma source of claim 8 , wherein the DC voltage source is coupled to the input section.

10. The plasma source of claim 9 , wherein the arbitrary waveform generator is coupled to the DC voltage source, wherein the arbitrary waveform generator is configured to generate a shaping control signal and provide the shaping control signal to the DC voltage source to shape an envelope of the amplified square waveform.

11. The plasma source of claim 8 , wherein each of the plurality of transistors of the half-bridge circuit is fabricated from Silicon Carbide or Gallium Nitride.

12. A method comprising:
generating a plurality of pulsed signals including a first pulsed signal and a second pulsed signal, wherein the first pulsed signal is in reverse synchronization with the second pulsed signal, wherein when the first pulsed signal transitions from a first low level to a first high level, the second pulsed signal transitions from a second high level to a second low level, and wherein when the first pulsed signal transitions from the first high level to the first low level, the second pulsed signal transitions from the second low level to the second high level;
receiving the plurality of pulsed signals to output an amplified square waveform; and
shaping the amplified square waveform.

13. The method of claim 12 , further comprising:
generating a shaping control signal; and
providing the shaping control signal to shape an envelope of the amplified square waveform.

14. A method comprising:
providing a frequency input having a frequency value;
generating an input signal, wherein the input signal is a square wave signal having a frequency based on the frequency value;
receiving the input signal to generate a plurality of pulsed signals, wherein one of the plurality of pulsed signals is in reverse synchronization with another one of the plurality of pulsed signals;
receiving the plurality of pulsed signals to output an amplified square waveform; and
shaping the amplified square waveform.

15. The method of claim 14 , wherein the plurality of pulsed signals include a first pulsed signal and second pulsed signal, the method further comprising:
amplifying the input signal to output an amplified signal;
outputting the first pulsed signal and the second pulsed signal upon reception of the amplified signal.

16. A plasma system comprising:
a plasma source including:
an input section configured to generate a square wave signal;
an output section coupled to the input section to receive the square wave signal, wherein the output section is configured to generate a plurality of pulsed signals based on the square wave signal, wherein the plurality of pulsed signals include a first pulsed signal and a second pulsed signal, wherein the first pulsed signal is in reverse synchronization with the second pulsed signal,
wherein the output section is configured to amplify the plurality of pulsed signals to output an amplified square waveform,
wherein the input section includes an arbitrary waveform generator coupled to the output section to shape the amplified square waveform; and
a reactive circuit coupled to the plasma source, wherein the reactive circuit is configured to receive the amplified square waveform to output a shaped sinusoidal waveform having a fundamental frequency; and
a plasma chamber coupled to the reactive circuit for receiving the shaped sinusoidal waveform.

17. The plasma system of claim 16 , wherein the reactive circuit includes a capacitor, wherein the capacitor is configured to remove higher-order frequencies of the amplified square waveform to output the shaped sinusoidal waveform having the fundamental frequency.

18. The plasma system of claim 16 , wherein the plasma chamber includes a transformer coupled plasma (TCP) coil coupled to the reactive circuit.

19. The plasma system of claim 16 , wherein the input section includes:
a contro

Assignees

• Lam Res Corp

Inventors

• Long Maolin
• Wang Yuhou
• Marsh Ricky
• Paterson Alex

Classifications

• H05H2242/24

  Radiofrequency or microwave generators · CPC title

• H05H2242/10

  Cooling arrangements · CPC title

• H03F3/2173

  of the bridge type · CPC title

• H01J37/32183 Primary

  Matching circuits · CPC title

• H01J37/248

  Components associated with high voltage supply · CPC title