Matchless plasma source for semiconductor wafer fabrication
US-12490370-B2 · Dec 2, 2025 · US
Cooling arrangements · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05H2242/10 |
| Official title | Cooling arrangements |
| Display label | Cooling arrangements |
| Total patents | 75 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 9 |
| 2020 | 2 |
| 2021 | 7 |
| 2022 | 7 |
| 2023 | 9 |
| 2024 | 11 |
| 2025 | 23 |
| 2026 | 5 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12490370-B2 · Dec 2, 2025 · US
US-12471202-B2 · Nov 11, 2025 · US
US-2025267783-A1 · Aug 21, 2025 · US
US-12382572-B2 · Aug 5, 2025 · US
US-2025220801-A1 · Jul 3, 2025 · US
US-2025203750-A1 · Jun 19, 2025 · US
US-2025203748-A1 · Jun 19, 2025 · US
US-12276031-B2 · Apr 15, 2025 · US
US-12267942-B2 · Apr 1, 2025 · US
US-2025106976-A1 · Mar 27, 2025 · US
US-2025067380-A1 · Feb 27, 2025 · US
US-2025046487-A1 · Feb 6, 2025 · US
US-12207385-B2 · Jan 21, 2025 · US
US-2024414832-A1 · Dec 12, 2024 · US
US-2024407075-A1 · Dec 5, 2024 · US
US-12156323-B2 · Nov 26, 2024 · US
US-2024381520-A1 · Nov 14, 2024 · US
US-2024284584-A1 · Aug 22, 2024 · US
US-2024237185-A1 · Jul 11, 2024 · US
US-2024199451-A1 · Jun 20, 2024 · US
Answers are generated from the same data shown on this page.