Matchless plasma source for semiconductor wafer fabrication
US-2026089828-A1 · Mar 26, 2026 · US
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Wang Yuhou patents
Wang Yuhou is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Yuhou |
| Total patents | 54 |
| First publication | Sep 14, 2017 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Rf pulsing within pulsing for semiconductor rf plasma processing
US-2025391638-A1 · Dec 25, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12507338-B2 · Dec 23, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12490370-B2 · Dec 2, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12484139-B2 · Nov 25, 2025 · US
Substrate location detection and adjustment
US-2025345945-A1 · Nov 13, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12471202-B2 · Nov 11, 2025 · US
RF pulsing within pulsing for semiconductor RF plasma processing
US-12424410-B2 · Sep 23, 2025 · US
Protection system for switches in direct drive circuits of substrate processing systems
US-2025273447-A1 · Aug 28, 2025 · US
Substrate location detection and adjustment
US-12397435-B2 · Aug 26, 2025 · US
Recent patents
Latest publications not already listed above.
Matchless plasma source for semiconductor wafer fabrication
US-2025220801-A1 · Jul 3, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025212310-A1 · Jun 26, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025203748-A1 · Jun 19, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025203749-A1 · Jun 19, 2025 · US
Apparatus and Method for Splitting Current from Direct-Drive Radiofrequency Signal Generator between Multiple Coils
US-2025174431-A1 · May 29, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025106976-A1 · Mar 27, 2025 · US
Protection system for switches in direct drive circuits of substrate processing systems
US-12261029-B2 · Mar 25, 2025 · US
Dual-frequency, direct-drive inductively coupled plasma source
US-2025079121-A1 · Mar 6, 2025 · US
A method and apparatus for enhancing ion energy and reducing ion energy spread in an inductively coupled plasma
US-2025046572-A1 · Feb 6, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12193138-B2 · Jan 7, 2025 · US
Dual-frequency, direct-drive inductively coupled plasma source
US-12165841-B2 · Dec 10, 2024 · US
Reference Box for Direct-Drive Radiofrequency Power Supply
US-2024404804-A1 · Dec 5, 2024 · US
Junction System for Direct-Drive Radiofrequency Power Supply
US-2024396372-A1 · Nov 28, 2024 · US
Metrology Enclosure Including Spectral Reflectometry System for Plasma Processing System Using Direct-Drive Radiofrequency Power Supply
US-2024395519-A1 · Nov 28, 2024 · US
Rf pulsing within pulsing for semiconductor rf plasma processing
US-2023360883-A1 · Nov 9, 2023 · US
Matchless plasma source for semiconductor wafer fabrication
US-2023354502-A1 · Nov 2, 2023 · US
RF pulsing within pulsing for semiconductor RF plasma processing
US-11728136-B2 · Aug 15, 2023 · US
Direct frequency tuning for matchless plasma source in substrate processing systems
US-11728137-B2 · Aug 15, 2023 · US
Protection System for Switches in Direct Drive Circuits of Substrate Processing Systems
US-2023245873-A1 · Aug 3, 2023 · US
Matchless plasma source for semiconductor wafer fabrication
US-11716805-B2 · Aug 1, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 54 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/32174 | 41 |
| H01J37/32183 | 33 |
| H01J2237/334 | 20 |
| H05H2242/24 | 20 |
| H05H1/4652 | 20 |