Packaging architecture with reinforcement structure in package substrate
US-12564058-B2 · Feb 24, 2026 · US
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Wagner Thomas patents
Wagner Thomas is listed as an inventor on 167 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wagner Thomas |
| Total patents | 167 |
| First publication | May 12, 2015 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaging architecture with reinforcement structure in package substrate
US-12550736-B2 · Feb 10, 2026 · US
Assembly of 2XD module using high density interconnect bridges
US-12525562-B2 · Jan 13, 2026 · US
Agricultural working machine and method
US-2026000023-A1 · Jan 1, 2026 · US
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
US-2025323155-A1 · Oct 16, 2025 · US
Fan out package with integrated peripheral devices and methods
US-2025309017-A1 · Oct 2, 2025 · US
Buried power rails integrated with decoupling capacitance
US-12431424-B2 · Sep 30, 2025 · US
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
US-2025285972-A1 · Sep 11, 2025 · US
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
US-2025285971-A1 · Sep 11, 2025 · US
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
US-12406925-B2 · Sep 2, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor structure and method for forming a semiconductor structure
US-12362241-B2 · Jul 15, 2025 · US
Fan out package with integrated peripheral devices and methods
US-12362251-B2 · Jul 15, 2025 · US
Boost Mode of a Motor Vehicle With an Electric Drive Machine
US-2025206149-A1 · Jun 26, 2025 · US
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
US-12341096-B2 · Jun 24, 2025 · US
Assembly and method for preventing warpage in a semiconductor package
US-2025201605-A1 · Jun 19, 2025 · US
Support structures for semiconductor substrates
US-2025201622-A1 · Jun 19, 2025 · US
Integrating and accessing passive components in wafer-level packages
US-12308335-B2 · May 20, 2025 · US
Vias through a die that are electrically isolated from active circuitry in the die
US-2025112139-A1 · Apr 3, 2025 · US
Direct die-two-die connection through an interposer without vias
US-2025112191-A1 · Apr 3, 2025 · US
Thermal interface material on a surface of a die in a cavity
US-2025112202-A1 · Apr 3, 2025 · US
Routing and Passive Components in a Direct Bonding Layer
US-2025006630-A1 · Jan 2, 2025 · US
Sensor device having a torque sensor unit and a steering angle sensor unit for a motor vehicle
US-2025002081-A1 · Jan 2, 2025 · US
Dielectric material and a mold compound with different dielectric constants coupled to a die that includes integrated circuitry
US-2024429117-A1 · Dec 26, 2024 · US
Glass layers and capacitors for use with integrated circuit packages
US-2024429221-A1 · Dec 26, 2024 · US
Antenna modules and communication devices
US-2024405433-A1 · Dec 5, 2024 · US
Heat dissipation solutions for integrated circuit packages
US-2024395655-A1 · Nov 28, 2024 · US
Spherical antenna arrangement with z-dimensional plated antenna structures
US-2024364023-A1 · Oct 31, 2024 · US
Antenna module with capacitive coupling
US-2024364000-A1 · Oct 31, 2024 · US
Integrated millimeter wave antenna esd protection
US-2024363556-A1 · Oct 31, 2024 · US
Rf antenna module using copper-to-copper interconnects between the antenna and the rf die
US-2024363567-A1 · Oct 31, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 78 |
| Intel Ip Corp | 50 |
| Kautex Textron Gmbh & Co Kg | 14 |
| Bosch Gmbh Robert | 9 |
| Wagner Thomas | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 77 |
| H10W90/701 | 68 |
| H10W90/724 | 63 |
| H10W74/117 | 53 |
| H10W70/685 | 52 |