Substrate supporting unit and film forming device having the substrate supporting unit

Patent metadata

Field	Value
Publication number	US-11201040-B2
Application number	US-201916553988-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Feb 28, 2017
Publication date	Dec 14, 2021
Grant date	Dec 14, 2021

Abstract

A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.

First claim

What is claimed is:

1. A substrate supporting unit comprising:
a shaft extending in an axial direction;
a first heater located in the shaft and configured to heat an upper portion of the shaft, the first heater comprising a first heating element having a first cross section in a plane through the axial direction, the first cross section of the first heating element having a first plurality of discontinuous cross-sectional areas; and
a stage located over the shaft and comprising:
a first plate;
a second plate over the first plate; and
a second heater between the first plate and the second plate, the second heater comprising a second heating element having a second cross section in the plane through the axial direction, the second cross section of the second heating element having a second plurality of discontinuous cross-sectional areas,

wherein each individual discontinuous cross-sectional area of the second cross section of the second heating element is greater than each individual discontinuous cross-sectional area of the first cross section of the first heating element.

2. The substrate supporting unit according to claim 1 ,
wherein the shaft comprises a main shaft, and
the first heater is sandwiched between the main shaft and the first plate.

3. The substrate supporting unit according to claim 2 ,
wherein the shaft further comprises a connector between the main shaft and the first plate,
the connector is in contact with at least one of the main shaft and the first plate, and
the first heater is sandwiched between the main shaft and the connector.

4. The substrate supporting unit according to claim 3 ,
wherein the main shaft has a tube shape and possesses a ring-shaped flange at a top edge portion thereof, and
the connector has a ring shape and covers the flange.

5. The substrate supporting unit according to claim 3 ,
wherein the connector is brazed or welded to the first plate.

6. The substrate supporting unit according to claim 1 ,
wherein the shaft possesses a tube shape and has a hollow therein,
a wiring connected to the first heater and a wiring connected to the second heater are arranged in the hollow, and
the first heater is arranged so as to surround the hollow.

7. The substrate supporting unit according to claim 1 ,
wherein a cross-sectional area of the shaft is smaller than a cross-sectional area of the first plate,
the shaft overlaps with a center of the first plate, and
the first heater is arranged so as to surround a normal line of the first plate passing through the center.

8. The substrate supporting unit according to claim 1 ,
wherein the shaft is brazed or welded to the first plate.

9. A film forming device comprising the substrate supporting unit according to claim 1 .

10. A film processing device comprising the substrate supporting unit according to claim 1 .

Assignees

• Nhk Spring Co Ltd

Inventors

• Takahara Go
• Hanamachi Toshihiko
• Tatsumi Arata

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0602

  Temperature monitoring · CPC title