Heated substrate support with temperature profile control

Patent metadata

Field	Value
Publication number	US-9698074-B2
Application number	US-201414481283-A
Country	US
Kind code	B2
Filing date	Sep 9, 2014
Priority date	Sep 16, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.

First claim

The invention claimed is:

1. A substrate support, comprising:
a plate having a substrate receiving surface and an opposite bottom surface; and
a shaft comprising an elongated structure having a first end coupled to the bottom surface of the plate and a second end, wherein a shaft heater is embedded in the first end of the shaft.

2. The substrate support of claim 1 , wherein the first end comprises a flange and the shaft heater is disposed within the flange.

3. The substrate support of claim 1 , wherein the shaft heater is a resistive heater.

4. The substrate support of claim 3 , wherein the shaft heater comprises a conductor embedded in the shaft.

5. The substrate support of claim 4 , wherein the conductor is coupled to a power supply to the shaft heater.

6. The substrate support of claim 1 , further comprising:
a power supply coupled to the shaft heater and coupled to a controller; and
a shaft temperature sensor disposed at the first end and coupled to the controller, wherein the shaft heater, the power supply, the controller, and the shaft temperature sensor are linked in a first closed loop control circuit.

7. The substrate support of claim 6 , wherein the plate further comprises:
a plate heater disposed in the plate;
a power supply coupled to the plate heater and coupled to the controller; and
a plate temperature sensor disposed in the plate and coupled to the controller,
wherein the plate heater, the power supply, the controller, and the plate temperature sensor are linked in a second closed loop control circuit.

8. The substrate support of claim 7 , wherein the controller is configured to independently control the first closed loop control circuit and the second closed loop control circuit to maintain the plate and the shaft at a preselected temperature.

9. The substrate support of claim 1 , wherein the shaft is formed from a layer of ceramic material.

10. The substrate support of claim 9 , wherein the ceramic material comprises one or more of silicon nitride (Si 3 N 4 ), alumina (Al 2 O 3 ), aluminum nitride (AlN), or silicon carbide (SiC).

11. The substrate support of claim 9 , wherein the shaft is formed from two or more layers of ceramic material.

12. The substrate support of claim 9 , wherein the shaft heater is disposed on a layer of ceramic material.

13. The substrate support of claim 9 , wherein the shaft further comprises a conductor disposed on the layer of ceramic material and coupled to the shaft heater.

14. A substrate support, comprising:
a plate having a substrate receiving surface and an opposite bottom surface;
a plate heater disposed in the plate;
a plate temperature sensor disposed in the plate, wherein the plate heater and the plate temperature sensor are coupled to a controller;
a shaft comprising an elongated structure having a first end coupled to the bottom surface of the plate and a second end, wherein a shaft heater is embedded in the first end of the shaft; and
a shaft temperature sensor disposed at the first end wherein the shaft temperature sensor and the shaft heater are coupled to a controller.

15. A method of making a substrate support, comprising:
forming a plate having a substrate receiving surface and an opposite bottom surface;
forming a first layer of ceramic material, the first layer comprising a first end and an opposite second end;
embedding a heater on the first layer at the first end;
disposing a conduit on the first layer such that one end of the conduit is coupled to the heater and a second end of the conduit extends beyond the second end of the ceramic material;
forming a second layer of ceramic material atop the first layer such the second layer at least partially covers the heater;
processing the first layer and the second layer to form a shaft; and
coupling the first end to the bottom surface of the plate.

16. The method of claim 15 , wherein the heater is printed on the first layer of ceramic material.

17. The method of claim 15 , further comprising embedding a plate heater in the plate.

18. The method of claim 15 , wherein the second layer at least partially covers the conduit.

19. The method of claim 15 , wherein the plate is formed from a ceramic material.

Assignees

• Applied Materials Inc

Inventors

• Merry Nir
• Volfovski Leon

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title