Memory structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11114570-B2
Application number	US-202016846393-A
Country	US
Kind code	B2
Filing date	Apr 12, 2020
Priority date	Apr 25, 2019
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A memory structure includes a substrate, a gate electrode, a first isolation layer, a thin metal layer, indium gallium zinc oxide (IGZO) particles, a second isolation layer, an IGZO channel layer, and a source/drain electrode. The gate electrode is located on the substrate. The first isolation layer is located on the gate electrode. The thin metal layer is located on the first isolation layer, and has metal particles. The IGZO particles are located on the metal particles. The second isolation layer is located on the IGZO particles. The IGZO channel layer is located on the second isolation layer. The source/drain electrode is located on the IGZO channel layer.

First claim

What is claimed is:

1. A memory structure, comprising:
a substrate;
a gate electrode located on the substrate;
a first isolation layer located on the gate electrode;
a thin metal layer located on the first isolation layer and having a plurality of metal particles;
a plurality of indium gallium zinc oxide (IGZO) particles located on the metal particles;
a second isolation layer located on the IGZO particles;
an IGZO channel layer located on the second isolation layer; and
a source/drain electrode located on the IGZO channel layer.

2. The memory structure of claim 1 , wherein a thickness of the thin metal layer is in a range from 1 nm to 20 nm.

3. The memory structure of claim 1 , wherein a thickness of each of the IGZO particles is in a range from 2 nm to 20 nm.

4. The memory structure of claim 1 , wherein the thin metal layer is made of a material comprising silver.

5. The memory structure of claim 1 , wherein the IGZO particles are in contact with the thin metal layer.

6. The memory structure of claim 1 , wherein the thin metal layer is in contact with the first isolation layer.

7. The memory structure of claim 1 , wherein the IGZO particles are located between the thin metal layer and the second isolation layer.

8. A manufacturing method of a memory structure, the manufacturing method comprising:
forming a thin metal layer on a first isolation layer that is on a gate electrode;
performing a thermal annealing treatment on the thin metal layer such that the thin metal layer has a plurality of metal particles;
forming a indium gallium zinc oxide (IGZO) material on the metal particles such that the IGZO material forms a plurality of IGZO particles;
forming a second isolation layer on the IGZO particles;
forming a IGZO channel layer on the second isolation layer; and
forming a source/drain electrode on the IGZO channel layer.

9. The manufacturing method of claim 8 , wherein forming the thin metal layer on the first isolation layer is performed by thermal evaporation.

10. The manufacturing method of claim 8 , wherein the thermal annealing treatment is performed on the thin metal layer under a temperature in a range from 50° C. to 300° C.

11. The manufacturing method of claim 8 , wherein forming the IGZO material on the metal particles is performed by sputtering.

12. The manufacturing method of claim 8 , wherein a thickness of the thin metal layer is in a range from 1 nm to 20 nm.

13. The manufacturing method of claim 8 , wherein a thickness of each of the IGZO particles is in a range from 2 nm to 20 nm.

14. The manufacturing method of claim 9 , wherein the thin metal layer is made of a material comprising silver.

Assignees

• E Ink Holdings Inc

Inventors

• Zan Hsiao-Wen
• Tsai Chuang-Chuang
• Lin Ching-Fu
• Li Zong-Xuan
• Chen Wei-Tsung

Classifications

• H10P14/3461

  Nanoparticles · CPC title

• H10P14/3434

  being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

• H10P14/22

  using physical deposition, e.g. vacuum deposition or sputtering · CPC title

• H10P14/274

  using seed materials · CPC title

• H10P14/3426

  Oxides · CPC title