Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device

Patent metadata

Field	Value
Publication number	US-10978489-B2
Application number	US-201615211068-A
Country	US
Kind code	B2
Filing date	Jul 15, 2016
Priority date	Jul 24, 2015
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

To provide a novel semiconductor device that is highly convenient or reliable, a novel display panel that is highly convenient or reliable, or a method for manufacturing a novel semiconductor device that is highly convenient or reliable. The semiconductor device includes an insulating film having an opening, a first connection portion penetrating the opening, a terminal that is in contact with one surface of the insulating film and is electrically connected to the first connection portion, and a circuit that is electrically connected to the first connection portion on the opposite surface of the insulating film. The terminal has a region embedded in the insulating film and a region not covered with the insulating film. The circuit includes a semiconductor element.

First claim

The invention claimed is:

1. A method for manufacturing a display panel comprising:
a first step for forming a first insulating film over a substrate for use in manufacturing processes;
a second step for forming a terminal so that the terminal includes a region overlapping with the first insulating film;
a third step for forming a second insulating film comprising a first opening on the terminal;
a fourth step for forming a first connection portion on the first opening so that the first connection portion is electrically connected to the terminal;
a fifth step for forming a circuit on a part of the first connection portion and the second insulating film;
a sixth step for forming a third insulating film which is over the circuit and comprises a second opening;
a seventh step for forming a display element on the third insulating film so that the display element is electrically connected to the circuit;
an eighth step of forming a protective film on the first insulating film, the terminal, the second insulating film, the first connection portion, the circuit, the third insulating film, and the display element;
a ninth step for bonding a base comprising a flexible region to the circuit with a bonding layer;
a tenth step for separating the substrate from the first insulating film for use in manufacturing processes; and
an eleventh step for removing the first insulating film so that the terminal is exposed,
wherein the bonding layer bonds the second insulating film and the base,
wherein the bonding layer is positioned between the protective film and the base after the ninth step, and
wherein one side surface of the third insulating film is in contact with the protective film on an outer side than the circuit and in a vicinity of the terminal.

2. The method for manufacturing a display panel according to claim 1 , wherein the first insulating film comprises silicon oxynitride.

3. The method for manufacturing a display panel according to claim 1 , wherein the removal of the first insulating film in the eleventh step is conducted by etching or chemical mechanical polishing.

4. A method for manufacturing a display panel comprising:
a first step for forming a first insulating film over a substrate for use in manufacturing processes;
a second step for forming a terminal so that the terminal includes a region overlapping with the first insulating film;
a third step for forming a second insulating film comprising a first opening on the terminal;
a fourth step for forming a first connection portion on the first opening so that the first connection portion is electrically connected to the terminal;
a fifth step for forming a circuit on a part of the first connection portion and the second insulating film;
a sixth step for forming a third insulating film which is over the circuit and comprises a second opening;
a seventh step for forming a display element on the third insulating film so that the display element is electrically connected to the circuit;
an eighth step of forming a protective film on the first insulating film, the terminal, the second insulating film, the first connection portion, the circuit, the third insulating film, and the display element;
a ninth step for separating the substrate from the first insulating film for use in manufacturing processes; and
a tenth step for removing the first insulating film so that the terminal is exposed,
wherein one side surface of the third insulating film is in contact with the protective film on an outer side than the circuit and in a vicinity of the terminal.

5. The method for manufacturing a display panel according to claim 4 , wherein the first insulating film comprises silicon oxynitride.

6. The method for manufacturing a display panel according to claim 4 , wherein the removal of the first insulating film in the tenth step is conducted by etching or chemical mechanical polishing.

Assignees

• Semiconductor Energy Lab

Inventors

• Hirakata Yoshiharu

Classifications

• H10D86/481

  integrated with passive devices, e.g. auxiliary capacitors · CPC title

• H10D86/443

  adapted for preventing breakage, peeling or short circuiting · CPC title

• H10D86/0212

  comprising manufacture, treatment or coating of substrates · CPC title

• H10D86/423

  comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO · CPC title

• H10D86/0214

  using temporary substrates · CPC title