MEMS component and method for encapsulating MEMS components

Patent metadata

Field	Value
Publication number	US-9853204-B2
Application number	US-201314650538-A
Country	US
Kind code	B2
Filing date	Oct 14, 2013
Priority date	Dec 11, 2012
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

First claim

The invention claimed is:

1. A Microelectromechanical Systems (MEMS) component comprising:
a substrate having an active surface, wherein electrical component structures and contact areas for making electrical contact with the electrical component structures are arranged on the substrate;
metallic column structures located on the contact areas and projecting beyond the electrical component structures;
a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures together with the metallic column structures;
a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein at least one portion of selected metallic column structures and the metallic frame structure penetrates through the resist layer to an extent such that those surfaces of the metallic column structures that face away from the substrate are not covered by the resist layer; and
a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and are electrically conductively connected to the surfaces of the metallic column structures not covered by the resist layer.

2. The MEMS component according to claim 1 , further comprising a further carrier layer arranged on the resist layer, the structured metallization being arranged on the further carrier layer.

3. The MEMS component according to claim 1 ,
wherein a carrier layer is arranged above the resist layer;
wherein the structured external contacts are arranged on the surface of the carrier layer; and
wherein plated-through holes through the carrier layer are provided that connect the external contacts to the metallic column structures.

4. The MEMS component according to claim 3 , wherein a hermetic layer seals a rear side of the substrate, the rear side being located opposite the active surface, relative to the carrier layer.

5. The MEMS component according to claim 4 ,
wherein the substrate is a piezoelectric wafer;
wherein the electrical component structures comprise an interdigital transducer;
wherein the carrier layer is a glass film; and
wherein the hermetic layer is a metallic layer.

6. A Microelectromechanical Systems (MEMS) component comprising:
a substrate having an active surface with electrical component structures and contact areas;
metallic column structures located on the contact areas;
a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures;
a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein selected ones of the metallic column structures penetrate through the resist layer such that surfaces of the selected metallic column structures that face away from the substrate are not covered by the resist layer; and
a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the surfaces of the metallic column structures.

7. The MEMS component according to claim 6 , further comprising a carrier layer arranged on the resist layer, the structured metallization being arranged on the carrier layer.

8. The MEMS component according to claim 7 ,
wherein the substrate is a piezoelectric wafer,
wherein the electrical component structures comprise an interdigital transducer, and
wherein the carrier layer is a glass film.

9. The MEMS component according to claim 6 , further comprising:
a carrier layer arranged on the resist layer;
structured external contacts arranged on the surface of the carrier layer; and
through holes located in the carrier layer such that the through holes connect the external contacts to the metallic column structures.

10. The MEMS component according to claim 9 , further comprising a hermetic layer, wherein the hermetic layer seals a rear side of the substrate, the rear side being located opposite to the active surface.

11. The MEMS component according to claim 10 ,
wherein the substrate is a piezoelectric wafer,
wherein the electrical component structures comprise an interdigital transducer,
wherein the carrier layer is a glass film, and
wherein the hermetic layer is a metallic layer.

12. The MEMS component according to claim 6 , further comprising a hermetic layer, wherein the hermetic layer seals a rear side of the substrate, the rear side being located opposite to the active surface.

13. A Microelectromechanical Systems (MEMS) component comprising:
a substrate having an active surface with electrical component structures and contact areas;
metallic column structures located on the contact areas;
a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures;
a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein the resist layer has an interface with the enclosed cavity; and
a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the metallic column structures.

14. The MEMS component according to claim 13 , further comprising a carrier layer arranged on the resist layer, the structured metallization being arranged on the carrier layer.

15. The MEMS component according to claim 14 ,
wherein the substrate is a piezoelectric wafer,
wherein the electrical component structures comprise an interdigital transducer, and
wherein the carrier layer is a glass film.

16. The MEMS component according to claim 13 , further comprising:
a carrier layer arranged on the resist layer;
structured external contacts arranged on the surface of the carrier layer; and
through holes located in the carrier layer such that the through holes connect the external contacts to the metallic column structures.

17. The MEMS component according to claim 16 , further comprising a hermetic layer, wherein the hermetic layer seals a rear side of the substrate, the rear side being located opposite to the active surface.

18. The MEMS component according to claim 17 ,
wherein the substrate is a piezoelectric wafer,
wherein the electrical component structures comprise an interdigital transducer,
wherein the carrier layer is a glass film, and
wherein the hermetic layer is a metallic layer.

19. The MEMS component according to claim 13 , further comprising a hermetic layer, wherein the hermetic layer seals a rear side of the substrate, the rear side being located opposite to the active surface.

Assignees

• Snaptrack Inc
• Snaptrack Inc

Inventors

• KRüGER HANS
• Stelzl Alois
• Bauer Christian
• Portmann Jürgen
• Pahl Wolfgang

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W72/0198

  batch processes · CPC title

• B81B7/0035

  for maintaining a controlled atmosphere inside of the chamber containing the MEMS · CPC title

• B81B7/007 Primary

  Interconnections between the MEMS and external electrical signals · CPC title