Metallic material and connection terminal

US11024996B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11024996-B2
Application numberUS-201916695451-A
CountryUS
Kind codeB2
Filing dateNov 26, 2019
Priority dateJan 18, 2019
Publication dateJun 1, 2021
Grant dateJun 1, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metallic material that includes a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the foundation material, at least in a contact portion electrically contacting an opposite electrically conductive member.

First claim

Opening claim text (preview).

What is claimed is: 1. A metallic material comprising: a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, the surface layer includes a precious metal portion containing the precious metal element as a main constituent, and a high-concentration In portion containing higher-concentration In than the precious metal portion, the precious metal portion and the high-concentration In portion are both exposed on the outermost surface, and a ratio of the high-concentration In portion to the precious metal portion is lower in an inner portion of the surface layer than in a surface portion of the surface layer. 2. The metallic material according to claim 1 , wherein the foundation material includes an intermediate layer formed on a base material, and the intermediate layer contains at least one kind selected from the group consisting of Cr, Mn, Fe, Co, Ni, and Cu. 3. The metallic material according to claim 1 , wherein at least part of the In contained in the surface layer is an alloy with the precious metal element. 4. The metallic material according to claim 1 , wherein the precious metal element contains at least either Ag or Au. 5. The metallic material according to claim 1 , wherein the precious metal element contains Ag, and the surface layer contains at least one kind of intermetallic compound selected from the group consisting of Ag 3 In, Ag 9 In 4 , and AgIn 2 . 6. A connection terminal being made of the metallic material according to claim 1 , wherein the surface layer is formed on a surface of the foundation material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Assignees

Inventors

Classifications

  • Alloys based on gold · CPC title

  • Alloys based on copper · CPC title

  • Alloys based on silver · CPC title

  • H01R13/03Primary

    characterised by the material, e.g. plating, or coating materials · CPC title

  • based on nickel · CPC title

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Frequently asked questions

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What does patent US11024996B2 cover?
A metallic material that includes a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, and a connection terminal being made of the metallic material, whe…
Who is the assignee on this patent?
Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
What technology area does this patent fall under?
Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).