Coated round wire
US-2024368794-A1 · Nov 7, 2024 · US
US9114594B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9114594-B2 |
| Application number | US-201213559551-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 26, 2012 |
| Priority date | Jul 26, 2011 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
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A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.
Opening claim text (preview).
What is claimed is: 1. An article comprising a substrate comprising copper or copper alloy adjacent to the substrate, a nickel layer adjacent the copper or copper alloy adjacent to the substrate, a tin layer adjacent the nickel layer and a silver layer adjacent the tin layer, the silver layer thickness to the tin layer thickness is 5:1 to 25:1. 2. The article of claim 1 , wherein the tin layer is 0.1-1 μm thick. 3. The article of claim 1 ,…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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